Photovoltaic Cell Module And Method Of Forming

ABSTRACT

A photovoltaic cell module, a photovoltaic array including at least two modules, and a method of forming the module are provided. The module includes a first outermost layer and a photovoltaic cell disposed on the first outermost layer. The module also includes a second outermost layer disposed on the photovoltaic cell and sandwiching the photovoltaic cell between the second outermost layer and the first outermost layer. The method of forming the module includes the steps of disposing the photovoltaic cell on the first outermost layer, disposing a silicone composition on the photovoltaic cell, and compressing the first outermost layer, the photovoltaic cell, and the second layer to form the photovoltaic cell module.

FIELD OF THE INVENTION

The present invention generally relates to a photovoltaic cell moduleand a photovoltaic array. More specifically, the present inventionrelates to a photovoltaic cell module including a first outermost layer,a photovoltaic cell, and a second outermost layer that has particularproperties and that is disposed on the photovoltaic cell sandwiching thephotovoltaic cell between the second outermost layer and the firstoutermost layer. The present invention also relates to a method offorming a photovoltaic cell module.

DESCRIPTION OF THE RELATED ART

Solar or photovoltaic cells are semiconductor devices used to convertlight into electricity. There are two general types of photovoltaiccells, wafers and thin films. Wafers are thin sheets of semiconductormaterial that are typically formed from mechanically sawing the waferfrom a single crystal or multicrystal ingot. Alternatively, wafers canbe formed from casting. Thin film photovoltaic cells usually includecontinuous layers of semi-conducting materials deposited on a substrateusing sputtering or chemical vapor deposition processing techniques.

Typically, the photovoltaic cells are included in photovoltaic cellmodules (modules) that also include tie layers, substrates,superstrates, and/or additional materials that provide strength andstability. Some modules include glass substrates bonded to glasssuperstrates using thick tie layers. These types of modules are usuallymade using processes that are slow and inefficient due to a need tocontrol the dispersion of the tie layers and to minimize leakage of thetie layers from the substrates and superstrates to reduce waste. Othertypes of modules are formed using copious amounts of tie layers that arepushed out from between the substrate and the superstrate and arediscarded. In both types of modules, it is difficult to control athickness of the tie layers because the tie layers can flow across thesubstrates and superstrates in inconsistent patterns. Additionally,methods of forming both types of modules results in increased expense,increased processing times, and increased processing complexity. Theseall result in increased cost for the end purchaser. Accordingly, thereremains an opportunity to develop an improved photovoltaic cell module,a photovoltaic array of modules, and a method of forming the modules.

SUMMARY OF THE INVENTION AND ADVANTAGES

The instant invention provides a photovoltaic cell module and a methodof forming the module. The photovoltaic cell module includes a firstoutermost layer having a light transmittance of at least 70 percent asdetermined by UV/Vis spectrophotometry using ASTM E424-71. Aphotovoltaic cell is disposed on the first outermost layer. The modulealso includes a second outermost layer opposite the first outermostlayer. The second outermost layer includes a silicone composition. Thesecond outermost layer is disposed on the photovoltaic cell andsandwiches the photovoltaic cell between the second outermost layer andthe first outermost layer.

A photovoltaic cell module is formed by a method of this invention. Inone embodiment, the method includes the steps of disposing thephotovoltaic cell on the first outermost layer, disposing a siliconecomposition on the photovoltaic cell, at least partially coating aplurality of fibers with the silicone composition to form a secondlayer, and compressing the first outermost layer, the photovoltaic cell,and the second layer to form the module. Relative to this embodiment,the plurality of fibers extends laterally across the second layer to aperiphery of the module on both ends of the module. As such, theplurality of fibers is able to resist leakage of the siliconecomposition from the module during the step of compressing.

The second (outermost) layer allows the photovoltaic cell to be securedwithin the module while simultaneously minimizing an amount of thesilicone composition that must be used. If utilized, the plurality offibers of the second (outermost) layer controls dispersion of thesilicone composition and a resulting thickness of the module and alsominimizes loss or leakage of the silicone composition outside of themodule such as during the step of compressing. The plurality of fibers,in conjunction with the silicone composition, also provides structuralstrength to the module, decreases flammability of the module, andincreases adhesion strength between the photovoltaic cell and the firstoutermost layer. The plurality of fibers and the silicone compositionalso allow the module to be rigid, semi-rigid, or flexible whilemaintaining electrical efficiency and structural integrity. Stillfurther, the plurality of fibers allows for cost effective andrepeatable production of the module because of controlled diffusion ofthe silicone composition, minimization of the amount of siliconecomposition used, minimized waste, and increased consistency ofthickness and size of the module. The plurality of fibers and thesilicone composition also allow for formation of a module without asupporting layer thereby reducing costs, production complexities, andtime needed to form the module.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Other advantages of the present invention will be readily appreciated,as the same becomes better understood by reference to the followingdetailed description when considered in connection with the accompanyingdrawings wherein:

FIG. 1 is a side cross-sectional view of a first photovoltaic cellmodule including a first outermost layer, a photovoltaic cell disposedon the first outermost layer, and a second outermost layer disposed onthe photovoltaic cell;

FIG. 2 is a side cross-sectional view of a second photovoltaic cellmodule formed from the method of this invention and including a firstoutermost layer, a photovoltaic cell disposed on the first outermostlayer, a second layer disposed on the photovoltaic cell, and asupporting layer disposed on the second layer as a second outermostlayer;

FIG. 3 is a side cross-sectional view of a third photovoltaic cellmodule including a first outermost layer, a tie layer disposed on, andin direct contact with, the first outermost layer, a photovoltaic celldisposed on, and spaced apart from, the first outermost layer, and asecond outermost layer disposed on the photovoltaic cell;

FIG. 4 is a side cross-sectional view of a fourth photovoltaic cellmodule formed from the method of this invention including a firstoutermost layer, a tie layer disposed on, and in direct contact with,the first outermost layer, a photovoltaic cell disposed on, and spacedapart from, the first outermost layer, a second layer disposed on thephotovoltaic cell, and a supporting layer disposed on, and in directcontact with, the second layer as a second outermost layer;

FIG. 5 is a side cross-sectional view of a second (outermost) layerincluding a plurality of fibers that are at least partially coated withthe silicone composition of this invention;

FIG. 6A is a side cross-sectional view of a series of photovoltaic cellmodules of FIG. 1 that are electrically connected and arranged as aphotovoltaic array;

FIG. 6B is a magnified side cross-sectional view of the series ofphotovoltaic cell modules of FIG. 1 that are electrically connected andarranged as a photovoltaic array;

FIG. 7 is a bottom cross-sectional view of the photovoltaic cell moduleof FIG. 1 wherein the plurality of fibers extends laterally (L) acrossthe second layer to a periphery of the photovoltaic cell module on bothends of the module to resist leakage of the silicone composition fromthe photovoltaic cell module;

FIG. 8 is a side cross-sectional view of a photovoltaic cell moduleincluding a first outermost layer, a photovoltaic cell disposed on thefirst outermost layer, and a second outermost layer disposed on thephotovoltaic cell wherein the second outermost layer is free of aplurality of fibers and is formed from a hydrosilylation-curablesilicone composition;

FIG. 9 is a side cross-sectional view of a photovoltaic cell moduleformed from the method of this invention and including a first outermostlayer, a photovoltaic cell disposed on the first outermost layer, asecond layer disposed on the photovoltaic cell, and a supporting layerdisposed on the second layer as a second outermost layer wherein thesecond layer is free of a plurality of fibers and is formed from ahydrosilylation-curable silicone composition;

FIG. 10 is a side cross-sectional view of a photovoltaic cell moduleincluding a first outermost layer, a tie layer disposed on, and indirect contact with, the first outermost layer, a photovoltaic celldisposed on, and spaced apart from, the first outermost layer, and asecond outermost layer disposed on the photovoltaic cell wherein thesecond outermost layer is free of a plurality of fibers and is formedfrom a hydrosilylation-curable silicone composition; and

FIG. 11 is a side cross-sectional view of a photovoltaic cell moduleformed from the method of this invention including a first outermostlayer, a tie layer disposed on, and in direct contact with, the firstoutermost layer, a photovoltaic cell disposed on, and spaced apart from,the first outermost layer, a second layer disposed on the photovoltaiccell, and a supporting layer disposed on, and in direct contact with,the second layer as a second outermost layer wherein the second layer isfree of a plurality of fibers and is formed from ahydrosilylation-curable silicone composition.

DETAILED DESCRIPTION OF THE INVENTION

The present invention provides a photovoltaic cell module 20(hereinafter referred to as “module”) generally shown in FIGS. 1-4,6A/B, and 7-11 and a method of forming the module 20. As is known in theart, modules 20 convert light energy into electrical energy due to aphotovoltaic effect. More specifically, modules 20 perform two primaryfunctions. A first function is photogeneration of charge carriers suchas electrons and holes in light absorbing materials. The second functionis direction of the charge carriers to a conductive contact to transmitelectricity.

The module 20 of the instant invention can be used in any industryincluding, but not limited to, automobiles, small electronics, remotearea power systems, satellites, space probes, radiotelephones, waterpumps, grid-tied electrical systems, batteries, battery chargers,photoelectrochemical applications, polymer solar cell applications,nanocrystal solar cell applications, and dye-sensitized solar cellapplications. In one embodiment, a series of modules 20 are electricallyconnected and form a photovoltaic array 32, as set forth in FIG. 6A.Photovoltaic arrays 32 are typically used on rooftops, in rural areasconnected to battery backups, and in DC pumps, signal buoys, and thelike. The photovoltaic array 32 of the instant invention may be planaror non-planar and typically functions as a single electricity producingunit wherein the modules 20 are interconnected in such a way as togenerate voltage.

The module 20 includes a first outermost layer 22 that has a lighttransmittance of at least 70 percent as determined using UV/Visspectrophotometry using ASTM E424-71. In one embodiment, the firstoutermost layer 22 has a light transmittance of at least 80 percent. Inan alternative embodiment, the first outermost layer 22 has a lighttransmittance of at least 90 percent. In still another embodiment, thefirst outermost layer 22 has a light transmittance of approximately 100percent.

Typically, the first outermost layer 22 provides protection to a frontsurface 34 of the module 20, as shown in FIGS. 1-4, 6A, and 8-11.Similarly, the first outermost layer 22 may provide protection to a backsurface of the module 20. The first outermost layer 22 may be soft andflexible or may be rigid and stiff. Alternatively, the first outermostlayer 22 may include rigid and stiff segments while simultaneouslyincluding soft and flexible segments. In one embodiment, the firstoutermost layer 22 includes glass. In another embodiment, the firstoutermost layer 22 includes an organic polymer. The organic polymer maybe selected from the group of, but is not limited to, polyimides,ethylene-vinyl acetate copolymers, and/or organic fluoropolymersincluding, but not limited to, ethylene tetrafluoroethylene (ETFE),polyethylene terephthalate (PET) alone or at least partially coated withsilicon and oxygen based materials (SiO_(x)), and combinations thereof.The first outermost layer 22 may alternatively include silicone, mayconsist essentially of silicone and not include organic monomers orpolymers, or may consist of silicone. Of course it is to be understoodthat the first outermost layer 22 is not limited to the aforementionedcompounds and may include any compound or composition known in the artso long as the first outermost layer 22 has a light transmittance of atleast 70 percent using ASTM E424-71.

The first outermost layer 22 may be load bearing or non load bearing andmay be included in any portion of the module 20. The first outermostlayer 22 may be a “top layer,” also known as a superstrate, or a “bottomlayer”, also known as a substrate, of the module 20. Bottom layers aretypically positioned behind photovoltaic cells 24 and serve asmechanical support. Relative to the method of this invention, the module20 may include a first outermost layer 22 as a top layer and anadditional layer that also has a light transmittance of at least 70percent using ASTM E424-71 as a bottom layer of the module 20 as asuperstrate. The additional layer may be the same as or different fromthe first outermost layer 22. Typically, the first outermost layer 22 ispositioned on a top of the module 20 and in front of a light source.Both the first outermost layer 22 and the additional layer may be usedto protect the module 20 from environmental conditions such as rain,show, and heat. In one embodiment, the first outermost layer 22 has alength and width of 125 mm each. In another embodiment, the firstoutermost layer 22 has a length and width of 156 mm each. Of course itis to be understood that the first outermost layer 22, and the instantinvention, are not limited to these dimensions.

In addition to the first outermost layer 22, the module 20 also includesa photovoltaic cell 24. The photovoltaic cell 24 is disposed on thefirst outermost layer 22. In one embodiment, the photovoltaic cell 24 isdisposed directly on the first outermost layer 22, i.e., in directcontact with the first outermost layer 22, as shown in FIGS. 1, 2, 6A/B,8 and 9. In another embodiment, the photovoltaic cell 24 is spaced apartfrom the first outermost layer 22 as shown in FIGS. 3 and 4 and 10 and11. The photovoltaic cell 24 may be disposed on, and in direct contactwith (i.e., directly applied to), the first outermost layer 22 viachemical vapor deposition and/or physical sputtering. Alternatively, thephotovoltaic cell 24 may be formed apart from the first outermost layer22 and/or the module 20 and later disposed on the first outermost layer22. In one embodiment, the photovoltaic cell 24 is be sandwiched betweenthe second (outermost) layer 26 and a tie layer 30, as described ingreater detail below and as shown in FIG. 3 and FIG. 10. It is to beappreciated that the terminology “second (outermost)” may apply to boththe second outermost layer and the second layer.

The photovoltaic cell 24 typically has a thickness of from 50 to 250,more typically of from 100 to 225, and most typically of from 175 to225, micrometers. In one embodiment, the photovoltaic cell 24 has alength and width of 125 mm each. In another embodiment, the photovoltaiccell 24 has a length and width of 156 mm each. Of course it is to beunderstood that the photovoltaic cell 24, and the instant invention, arenot limited to these dimensions.

The photovoltaic cell 24 may include large-area, single-crystal, singlelayer p-n junction diodes. These photovoltaic cells 24 are typicallymade using a diffusion process with silicon wafers. Alternatively, thephotovoltaic cell 24 may include thin epitaxial deposits of (silicon)semiconductors on lattice-matched wafers. In this embodiment, thephotovoltaic cell 24 may be classified as either space or terrestrialand typically has AM0 efficiencies of from 7 to 40%. Further, thephotovoltaic cell 24 may include quantum well devices such as quantumdots, quantum ropes, and the like, and also include carbon nanotubes.Without intending to be limited by any particular theory, it is believedthat these types of photovoltaic cells 24 can have up to a 45% AM0production efficiency. Still further, the photovoltaic cell 24 mayinclude mixtures of polymers and nano particles that form a singlemulti-spectrum layer which can be stacked to make multi-spectrum solarcells more efficient and less expensive.

The photovoltaic cell 24 may include amorphous silicon, monocrystallinesilicon, polycrystalline silicon, microcrystalline silicon,nanocrystalline silica, cadmium telluride, copper indium/galliumselenide/sulfide, gallium arsenide, polyphenylene vinylene, copperphthalocyanine, carbon fullerenes, and combinations thereof in ingots,ribbons, thin films, and/or wafers. The photovoltaic cell 24 may alsoinclude light absorbing dyes such as ruthenium organometallic dyes. Mosttypically, the photovoltaic cell 24 includes monocrystalline andpolycrystalline silicon.

The photovoltaic cell 24 has a first side and a second side. Typicallythe first side is opposite the second side. However, the first andsecond sides may be adjacent each other. A first electrical lead istypically disposed on the first side while a second electrical lead istypically disposed on the second side. One of the first and secondelectrical leads typically acts as an anode while the other typicallyacts as a cathode. The first and second electrical leads may be the sameor may be different and may include metals, conducting polymers, andcombinations thereof. In one embodiment, the first and second electricalleads include tin-silver solder coated copper. In another embodiment,the first and second electrical leads include tin-lead solder coatedcopper.

The first and second electrical leads may be disposed on any part of thefirst and second sides of the photovoltaic cell 24. The first and secondelectrical leads may be of any size and shape and typically arerectangular-shaped and have dimensions of approximately 0.005 to 0.080inches in length and/or width. The first and second electrical leadstypically connect the module 20 to additional modules 20 in aphotovoltaic array 32, as shown in FIG. 6A. The modules 20 may beconnected in series or in parallel.

The module 20 also includes the second (outermost) layer 26 disposed onthe photovoltaic cell 24. More specifically, the module 22, as set forthin FIGS. 1, 3, 6A/B, and 8-11 includes the second (outermost) layer 26.The module 22, including the second (outermost) layer 26, has sufficientstrength and rigidity without use of any supporting layer 28, describedin greater detail below. In other words, the module 22 may include thesecond (outermost) layer 26 as the bottom-most layer and not include anyadditional layers apart from the photovoltaic cell 24 and the firstoutermost layer 22.

However, relative to the method of this invention, the module 22 that isformed may include the second layer 26 as an outermost layer or as aninterior layer. Relative to the instant invention, the second(outermost) layer 26 may bind the first outermost layer 22 to thephotovoltaic cell 24 and/or at least partially encapsulate thephotovoltaic cell 24. The second (outermost) layer 26 may be disposeddirectly on the photovoltaic cell 24, i.e., in direct contact with thephotovoltaic cell 24, as shown in FIGS. 1-4, 6A/B, and 8-11, or may bespaced apart from the photovoltaic cell 24. In various embodiments, thesecond (outermost) layer 26 is further defined as a controlled beaddisposed on the photovoltaic cell 24. In various embodiments, the second(outermost) layer 26 is a controlled bead of the liquid siliconecomposition. The controlled bead is typically applied in a rectangularshape. However, the controlled bead may be formed in any shape.Typically, the controlled bead is in contact with an interior portion ofthe first outermost layer 22, the photovoltaic cell 24, or both thefirst outermost layer 22 and the photovoltaic cell 24 thereby leaving aspace along a perimeter of the first outermost layer 22, thephotovoltaic cell 24, or both the first outermost layer 22 and thephotovoltaic cell 24 that does not include the second (outermost) layer26. In one embodiment, this space is approximately ½ inch in width. Thesecond (outermost) layer 26 typically has a thickness of from 1 to 50,more typically of from 4 to 40, even more typically of from 3 to 30, andstill more typically of from 4 to 15, and most typically of from 4 to10, mils. The second (outermost) layer 26 may be tacky or non-tacky andmay be a gel, gum, liquid, paste, resin, or solid. In one embodiment,the second (outermost) layer 26 is substantially free of entrapped air(bubbles). The terminology “substantially free” means that the second(outermost) layer 26 has no visible air bubbles. In the method of thisinvention, the second (outermost) layer 26 is formed from a liquidsilicone composition, described in detail below, but may be cured orpartially cured to be tacky or non-tacky and/or a gel, gum, liquid,paste, resin, or solid. In one embodiment, partial curing occurs whenless than 90 percent of appropriate (i.e., expected) reactive moietiesreact. In another embodiment, curing occurs when at least 90 percent ofappropriate (i.e., expected) reactive moieties react. The second(outermost) layer 26 may include or be free of one or more ofpolyethylene terephthalate, polyethylene naphthalate, polyvinylfluoride, and ethylene vinyl acetate.

In one embodiment, the second (outermost) layer 26 includes a pluralityof fibers 27, as shown in the Figures. In another embodiment, the second(outermost) layer 26 is free of the plurality of fibers 27, as isdescribed in greater detail below. In FIGS. 6A/B, the detail for thefibers 27 has been merely omitted for the sake of clarity. The second(outermost) layer 26 typically includes at least two, and may include anunlimited number of, individual fibers 27. The terminology “fiber”includes continuous filaments and/or discrete lengths of materials thatmay be natural or synthetic. Natural fibers include, but are not limitedto, those produced by plants, animals, and geological processes such asvegetable, wood, animal, and natural mineral fibers. Synthetic fibersinclude, but are not limited to, non-natural mineral fibers such asfiberglass, metallic fibers, carbon fibers, polymer fibers such aspolyamide fibers, PET or PBT polyester fibers, phenol-formaldehyde (PF)fibers, polyvinyl alcohol fiber (PVOH) fibers, polyvinyl chloride fiber(PVC) fibers, polyolefins fibers, acrylic fibers, polyacrylonitrilefibers, aromatic polyamide (aramid) fibers, elastomeric fibers,polyurethane fibers, microfibers, and combinations thereof.

In one embodiment, the plurality of fibers 27 has a high modulus andhigh tensile strength. In another embodiment, the plurality of fibers 27has a Young's modulus at 25° C. of at least 3 GPa. For example, theplurality of fibers 27 may have a Young's modulus at 25° C. of from 3 to1,000 GPa, alternatively from 3 to 200 GPa, alternatively from 10 to 100GPa. Moreover, the plurality of fibers 27 may have a tensile strength at25° C. of at least 50 MPa. For example, the plurality of fibers 27 mayhave a tensile strength at 25° C. of from 50 to 10,000 MPa,alternatively from 50 to 1,000 MPa, alternatively from 50 to 500 MPa.

The individual fibers 27 are typically cylindrical in shape and may havea diameter of from 1 to 100 μm, alternatively from 1 to 20 μm, andalternatively form 1 to 10 μm. The plurality of fibers 27 may beheat-treated prior to use to remove organic contaminants. For example,the plurality of fibers 27 may be heated in air at an elevatedtemperature, for example, 575° C., for a suitable period of time, forexample 2 h.

In one embodiment, the plurality of fibers 27 is further defined as amat or roving. In another embodiment, the plurality of fibers 27 isfurther defined as a textile. The textile may be woven or non-woven ormay include both woven and non-woven segments. In one embodiment, thetextile is woven and is selected from the group of fiberglass,polyester, polyethylene, polypropylene, nylon, and combinations thereof.In another embodiment, the textile is non-woven and is selected from thegroup of fiberglass, polyester, polyethylene, polypropylene, nylon, andcombinations thereof. In a further embodiment, the textile is non-wovenfiberglass and is commercially available from Crane Nonwovens of Dalton,Mass. Alternatively, the textile may be non-woven polyester commerciallyavailable from Crane Nonwovens. Further, the textile may be non-wovenand include polypropylene or polyethylene terephthalate. Of course, itis to be understood that the textile is not limited to aforementionedtypes of woven and non-woven textiles and may include any woven ornon-woven textile known in the art. In one embodiment, the second(outermost) layer 26 includes more than one textile, e.g. two, three, ormore individual textiles.

As is known in the art, woven textiles are typically cloths that areformed by weaving and that stretch in bias directions. As is also knownin the art, non-woven textiles are neither woven nor knit and aretypically manufactured by putting individual fibers 27 together in theform of a sheet or web, and then binding them either mechanically, withan adhesive, or thermally by melting a binder onto the textile.Non-woven textiles may include staple non-woven textiles and spunlaidnon-woven textiles. Staple non-woven textiles are typically made byspinning fibers that are spread in a uniform web and then bonded byusing either resin or heat. Spunlaid non-woven textiles are typicallymade in one continuous process by spinning fibers directly disposed intoa web. The spunlaid process can be combined with a meltblowing processto form a SMS (spun-melt-spun) non-woven textile.

Non-woven textiles may also include films and fibrillates and can beformed using serration or vacuum-forming to form patterned holes.Fiberglass non-woven textiles typically are one of two types includingwet laid mats having wet-chopped, denier fibers having 6 to 20micrometer diameters or flame attenuated mats having discontinuousdenier fibers having 0.1 to 6 micrometer diameters.

As first introduced above, the plurality of fibers 27 is at leastpartially coated with a silicone composition. In various embodiments, atleast 50, 75, or 95 percent of a total surface area of the plurality offibers 27 is coated with the silicone composition. In anotherembodiment, approximately 100 percent of a total surface area of theplurality of fibers 27 is coated with the silicone composition. FIG. 5illustrates that at least 50 percent of a total surface area of theplurality of fibers 27 may be coated with the silicone composition.

The terminology “coated” refers to covering at least part of the surfacearea of the plurality of fibers 27. Typically, the silicone compositionexudes through portions of the plurality of fibers 27 (e.g. the textile)such as pores. In one embodiment, as set forth in FIG. 5, the pluralityof fibers 27 is further defined as a textile and defines voids throughwhich the silicone composition may exude. In an alternative embodiment,the plurality of fibers 27 is further defined as being impregnated withthe silicone composition. The silicone composition may impregnate someor all of the plurality of fibers 27. That is, in this embodiment, thesilicone composition coats an exterior (surface area) of the pluralityof fibers 27 and is also disposed throughout some or all of the voidsdefined by the plurality of fibers 27. In other words, in thisembodiment, the silicone composition may exude through some voids andnot through others. In a further embodiment, the plurality of fibers 27is saturated with the silicone composition. In another embodiment, theplurality of fibers 27 is not saturated with the silicone composition.It is also contemplated that the silicone composition may encapsulatethe plurality of fibers 27 in whole or in part. The silicone compositionmay also encapsulate the photovoltaic cell 24 in whole or in part. Thesurface area of the plurality of fibers 27 may be partially coated usingany method known in the art including, but not limited to, spraying,dipping, rolling, brushing, and combinations thereof. In one embodiment,the plurality of fibers 27 is placed into the silicone composition. Thesilicone composition typically coats at least a part of the totalsurface area of the plurality of fibers 27 in a thickness 1 to 50, moretypically of from 3 to 30, and most typically of from 4 to 15, mils. Ofcourse, the invention is not limited to these thicknesses.

Referring back, the silicone composition may be any known in the art andmay include, but is not limited to, silanes, siloxanes, silazanes,silylenes, silyl radicals or ions, elemental silicon, silenes, silanols,polymers thereof, and combinations thereof. In addition, the siliconecomposition may be cured, partially cured, or completely cured by anymechanism known in the art including, but not limited to, free radicalreactions, hydrosilylation reactions, condensation or additionreactions, heat curing, UV curing, and combinations thereof. Typically,the silicone composition of this invention is further defined ashydrosilylation-curable. Thus, hydrosilylation cure silicone chemistryis focused on below. However, the invention is not limited tohydrosilylation cure silicone chemistry, as introduced above.

In one embodiment, the silicone composition includes an organosiliconcompound, an organohydrogensilicon compound, and a hydrosilylationcatalyst. The organosilicon compound typically has at least oneunsaturated moiety per molecule and may include a single organosiliconcompound, two organosilicon compounds, or a plurality of organosiliconcompounds. In various embodiments, the organosilicon compound has two,three, or multiple unsaturated moieties per molecule. In one embodiment,the organosilicon compound includes an alkenyl siloxane wherein analkenyl group is pending from a siloxane group. The alkenyl group may belocated at any interval and/or location in the siloxane group. That is,the alkenyl group may be terminal, pendant, or if the organosiliconcompound includes more than one alkenyl group, the alkenyl groups may beboth terminal and pendant. In one embodiment, the organosilicon compoundis terminated with a siloxane that is itself alkenyl terminated. Inanother embodiment, the alkenyl siloxane is an alkenyl-terminatedsiloxane, i.e., the alkenyl group may be located at one or more terminalends of the siloxane group. Alternatively, the alkenyl siloxane may bean alkenyl-pendent siloxane. The alkenyl-pendent siloxane typicallyincludes at least one alkenyl group pending from any location along thesiloxane group other than at one of the terminal ends of the siloxanegroup. The alkenyl-terminated or -pendant siloxane may be linear,branched, cyclic, or any combination thereof. The alkenyl group mayinclude a carbon chain pending directly from at least one terminal endof the siloxane group or from a location along the siloxane group thatis not a terminal end, and may have from two to twelve carbon atoms withat least one C═C bond. Preferably, the C═C bond is located at an end ofthe carbon chain, such as vinyl, 5-hexenyl, 7-octenyl, etc. In addition,the alkenyl group is not limited to one C═C bond and may include morethan one C═C bond. Further, the alkenyl-terminated siloxane may includemore than one alkenyl group. The more than one alkenyl group may bebonded to the same atom within the siloxane or, alternatively, may bebonded to different atoms in the siloxane. It is also contemplated thatthe at least one unsaturated moiety may include alkynyl groups which maybe substituted for alkenyl groups, where chemically appropriate.

In various embodiments, the organosilicon compound has silicon-bondedalkenyl groups and typically is a copolymer including R²SiO_(3/2) units,i.e., T units, and/or SiO_(4/2) units, i.e., Q units, in combinationwith R¹R² ₂SiO_(1/2) units, i.e., M units, and/or R² ₂SiO_(2/2) units,i.e., D units, wherein R¹ is a C₁ to C₁₀ hydrocarbyl group or a C₁ toC₁₀ halogen-substituted hydrocarbyl group, both free of aliphaticunsaturation, and R² is an alkenyl group. For example, the organosiliconcompound can be further defined as a DT resin, an MT resin, an MDTresin, a DTQ resin, an MTQ resin, an MDTQ resin, a DQ resin, an MQresin, a DTQ resin, an MTQ resin, or an MDQ resin, so long as it has atleast one unsaturated moiety per molecule.

The C₁ to C₁₀ hydrocarbyl group and C₁ to C₁₀ halogen-substitutedhydrocarbyl group represented by R¹ more typically have from 1 to 6carbon atoms. Acyclic hydrocarbyl and halogen-substituted hydrocarbylgroups containing at least 3 carbon atoms can have a branched orunbranched structure. Examples of hydrocarbyl groups represented by R¹include, but are not limited to, alkyl groups, such as methyl, ethyl,propyl, 1-methylethyl, butyl, 1-methylpropyl, 2-methylpropyl,1,1-dimethylethyl, pentyl, 1-methylbutyl, 1-ethylpropyl, 2-methylbutyl,3-methylbutyl, 1,2-dimethylpropyl, 2,2-dimethylpropyl, hexyl, heptyl,octyl, nonyl, and decyl, cycloalkyl groups, such as cyclopentyl,cyclohexyl, and methylcyclohexyl, aryl groups, such as phenyl andnaphthyl, alkaryl groups, such as tolyl and xylyl, and aralkyl groups,such as benzyl and phenethyl. Examples of halogen-substitutedhydrocarbyl groups represented by R¹ include, but are not limited to,3,3,3-trifluoropropyl, 3-chloropropyl, chlorophenyl, dichlorophenyl,2,2,2-trifluoroethyl, 2,2,3,3-tetrafluoropropyl, and2,2,3,3,4,4,5,5-octafluoropentyl.

The alkenyl groups represented by R², which may be the same or differentwithin the organosilicon compound, typically have from 2 to 10 carbonatoms, alternatively from 2 to 6 carbon atoms, and are exemplified by,but are not limited to, vinyl, allyl, methallyl, butenyl, hexenyl,octenyl, decenyl, cycohexenyl, styryl, and the like.

In one embodiment, the organosilicon compound is further defined ashaving the formula:

(R¹R² ₂SiO_(1/2))_(w)(R² ₂SiO_(2/2))_(x)(R²SiO_(3/2))_(y)(SiO_(4/2))_(z)  (I)

wherein R¹ and R² are as described and exemplified above and w, x, y,and z are mole fractions. Typically, the organosilicon compoundrepresented by formula (I) has an average of at least two silicon-bondedalkenyl groups per molecule. More specifically, the subscript wtypically has a value of from 0 to 0.9, alternatively from 0.02 to 0.75,alternatively from 0.05 to 0.3. The subscript x typically has a value offrom 0 to 0.9, alternatively from 0 to 0.45, alternatively from 0 to0.25. The subscript y typically has a value of from 0 to 0.99,alternatively from 0.25 to 0.8, alternatively from 0.5 to 0.8. Thesubscript z typically has a value of from 0 to 0.85, alternatively from0 to 0.25, alternatively from 0 to 0.15. Also, the ratio y+z/(w+x+y+z)is typically from 0.1 to 0.99, alternatively from 0.5 to 0.95,alternatively from 0.65 to 0.9. Further, the ratio w+x/(w+x+y+z) istypically from 0.01 to 0.90, alternatively from 0.05 to 0.5,alternatively from 0.1 to 0.35.

Additional non-limiting examples of suitable organosilicon compoundsrepresented by formula (I) set forth above include, but are not limitedto, resins having the following formulae:

(Vi₂MeSiO_(1/2))_(0.25)(PhSiO_(3/2))_(0.75),(ViMe₂SiO_(1/2))_(0.25)(PhSiO_(3/2))_(0.75),

(ViMe₂SiO_(1/2))_(0.25)(MeSiO_(3/2))_(0.25)(PhSiO_(3/2))_(0.50),

(ViMe₂SiO_(1/2))_(0.15)(PhSiO_(3/2))_(0.75)(SiO_(4/2))_(0.1), and

(Vi₂MeSiO_(1/2))_(0.15)(ViMe₂SiO_(1/2))_(0.1)(PhSiO_(3/2))_(0.75),

wherein Me is methyl, Vi is vinyl, Ph is phenyl, and the numericalsubscripts outside the parenthesis denote mole fractions correspondingto either w, x, y, or z as described above for formula (I) set forthabove. The sequence of units in the preceding formulae is not to beviewed in any way as limiting to the scope of the invention.

The organosilicon compound represented by formula (I) typically has anumber-average molecular weight (M_(n)) of from 500 to 50,000,alternatively from 500 to 10,000, alternatively 1,000 to 3,000, g/mol,where the molecular weight is determined by gel permeationchromatography employing a low angle laser light scattering detector, ora refractive index detector and silicone resin (MQ) standards. Theviscosity of the organosilicon compound represented by formula (I) at25° C. may be from 0.01 to 100,000 Pa·s, alternatively from 0.1 to10,000 Pa·s, alternatively from 1 to 100 Pa·s.

The organosilicon compound represented by formula (I) typically includesless than 10% (w/w), alternatively less than 5% (w/w), alternativelyless than 2% (w/w), of silicon-bonded hydroxy groups, as determined by²⁹Si NMR.

In one embodiment, the organosilicon compound is further defined as adialkylvinylsiloxy-terminated dialkyl siloxane. In another embodiment,the organosilicon compound is further defined as adialkylalkenylsiloxy-terminated dialkylsiloxane. Non-limiting examplesof the organosilicon compound include dimethylvinylsiloxy-terminateddimethylsiloxane, dimethylvinylsiloxy-terminated dimethyl siloxane,methylvinyl siloxane, and combinations thereof. In yet anotherembodiment, the organosilicon compound is further defined asdimethylvinylsiloxy-pendent dimethylsiloxane. Alternatively, theorganosilicon compound may be further defined as an alkenyldialkylsilylend-blocked polydialkylsiloxane. In one embodiment, the organosiliconcompound is further defined as vinyldimethylsilyl end-blockedpolydimethylsiloxane.

Referring back, the silicone composition also typically includes theorganohydrogensilicon compound having at least one silicon-bondedhydrogen atom per molecule. The organohydrogensilicon compound mayinclude a single organohydrogensilicon compound, twoorganohydrogensilicon compounds, or a plurality of organohydrogensiliconcompounds. The organohydrogensilicon compound typically has an averageof at least two silicon-bonded hydrogen atoms per molecule, andalternatively at least three silicon-bonded hydrogen atoms per molecule.The organohydrogensilicon compound may be further defined as anorganohydrogensilane, an organohydrogensiloxane, or a combinationthereof. The structure of the organohydrogensilicon compound can belinear, branched, cyclic, or resinous. In acyclic polysilanes andpolysiloxanes, the silicon-bonded hydrogen atoms can be located atterminal, pendant, or at both terminal and pendant positions.Cyclosilanes and cyclosiloxanes typically have from 3 to 12 siliconatoms, alternatively from 3 to 10 silicon atoms, alternatively from 3 to4 silicon atoms.

The organohydrogensilane can be a monosilane, disilane, trisilane, orpolysilane. Some non-limiting examples of suitable organohydrogensilanesinclude diphenylsilane, 2-chloroethylsilane,bis[p-dimethylsilyl)phenyl]ether, 1,4-dimethyldisilylethane,1,3,5-tris(dimethylsilyl)benzene, 1,3,5-trimethyl-1,3,5-trisilane,poly(methylsilylene)phenylene, and poly(methylsilylene)methylene.

The organohydrogensilane can also have the formula:

HR¹ ₂Si—R³—SiR¹ ₂H   (II)

wherein R¹ is as defined and exemplified above and R³ is ahydrocarbylene group free of aliphatic unsaturation having a formulaselected from the following structures:

wherein g is from 1 to 6.

Specific examples of organohydrogensilanes of the above formula (II)wherein R¹ and R³ are as described and exemplified above include, butare not limited to, organohydrogensilanes having a formula selected fromthe following structures:

The organohydrogensiloxane can be a disiloxane, trisiloxane, orpolysiloxane. Specific non-limiting examples of suitableorganohydrogensiloxanes include 1,1,3,3-tetramethyldisiloxane,1,1,3,3-tetraphenyldisiloxane, phenyltris(dimethylsiloxy)silane,1,3,5-trimethylcyclotrisiloxane, a trimethylsiloxy-terminatedpoly(methylhydrogensiloxane), a trimethylsiloxy-terminatedpoly(dimethylsiloxane/methylhydrogensiloxane), adimethylhydrogensiloxy-terminated poly(methylhydrogensiloxane), and aresin including HMe₂SiO_(1/2) units, Me₃SiO_(1/2) units, and SiO_(4/2)units, wherein Me is methyl.

The organohydrogensiloxane may be further defined as anorganohydrogenpolysiloxane resin, so long as the resin includes at leastone silicon-bonded hydrogen atom per molecule. Theorganohydrogenpolysiloxane resin may be a copolymer includingR⁴SiO_(3/2) units, i.e., T units, and/or SiO_(4/2) units, i.e., Q units,in combination with R¹R⁴ ₂SiO_(1/2) units, i.e., M units, and/or R⁴₂SiO_(2/2) units, i.e., D units, wherein R¹ is as described andexemplified above. For example, the organohydrogenpolysiloxane resin canbe a DT resin, an MT resin, an MDT resin, a DTQ resin, an MTQ resin, anMDTQ resin, a DQ resin, an MQ resin, a DTQ resin, an MTQ resin, or anMDQ resin.

The group represented by R⁴ is typically an organosilylalkyl grouphaving at least one silicon-bonded hydrogen atom. Examples oforganosilylalkyl groups represented by R⁴ include, but are not limitedto, groups having a formula selected from the following structures:

—CH₂CH₂SiMe₂H,

—CH₂CH₂SiMe₂C_(n)H_(2n)SiMe₂H, —CH₂CH₂SiMe₂C_(n)H_(2n)SiMePhH,

—CH₂CH₂SiMePhH, —CH₂CH₂SiPh₂H, —CH₂CH₂SiMePhC_(n)H_(2n)SiPh₂H,

—CH₂CH₂SiMePhC_(n)H_(2n)SiMe₂H, —CH₂CH₂SiMePhOSiMePhH, and

—CH₂CH₂SiMePhOSiPh(OSiMePhH)_(2,)

wherein Me is methyl, Ph is phenyl, and the subscript n has a value offrom 2 to 10.

In various embodiments, the organohydrogenpolysiloxane resin has theformula:

(R¹R⁴ ₂SiO_(1/2))_(w)(R⁴ ₂SiO_(2/2))_(x)(R⁴SiO_(3/2))_(y)(SiO_(4/2))_(z)

wherein R¹, R⁴, w, x, y, and z are each as defined and exemplifiedabove. Specific examples of organohydrogenpolysiloxane resinsrepresented by the above formula include, but are not limited to, resinshaving the following formulae:

((HMe₂SiC₆H₄SiMe₂CH₂CH₂)₂MeSiO_(1/2))_(0.12)(PhSiO_(3/2))_(0.88),

((HMe₂SiC₆H₄SiMe₂CH₂CH₂)₂MeSiO_(1/2))_(0.17)(PhSiO_(3/2))_(0.83),

((HMe₂SiC₆H₄SiMe₂CH₂CH₂)₂MeSiO_(1/2))_(0.17)(MeSiO_(3/2))_(0.17)(PhSiO_(3/2))_(0.66),

((HMe₂SiC₆H₄SiMe₂CH₂CH₂)₂MeSiO_(1/2))_(0.15)(PhSiO_(3/2))_(0.75)(SiO_(4/2))_(0.10),and

((HMe₂SiC₆H₄SiMe₂CH₂CH₂)₂MeSiO_(1/2))_(0.08)((HMe₂SiC₆H₄SiMe₂CH₂CH₂)Me₂SiO_(1/2))_(0.06)(PhSiO_(3/2))_(0.86),

wherein Me is methyl, Ph is phenyl, C₆H₄ denotes a para-phenylene group,and the numerical subscripts outside the parenthesis denote molefractions. The sequence of units in the preceding formulae is not to beviewed in any way as limiting to the scope of the invention.

The organohydrogensilicon compound may have a molecular weight less than1,000, alternatively less than 750, alternatively less than 500, g/mol.In addition, the organohydrogensilicon compound can be a singleorganohydrogensilicon compound or a mixture comprising two or moredifferent organohydrogensilicon compound, each as described above. Forexample, the organohydrogensilicon compound can be a singleorganohydrogensilane, a mixture of two different organohydrogensilanes,a single organohydrogensiloxane, a mixture of two differentorganohydrogensiloxanes, or a mixture of an organohydrogensilane and anorganohydrogensiloxane, so long as the organohydrogensilicon compoundhas at least one silicon-bonded hydrogen atom per molecule. In oneembodiment, the organohydrogensilicon compound is further defined as adimethylhydrogensilyl terminated polydimethylsiloxane. Theorganohydrogensilicon compound may also be further defined as atrialkylsilyl terminated polydialkylsiloxane-alkylhydrogensiloxaneco-polymer. In one embodiment, the organohydrogensilicon compound isfurther defined as a trimethylsilyl terminatedpolydimethylsiloxane-methylhydrogensiloxane co-polymer. In oneembodiment, the organohydrogensilicon compound is further defined as amixture of a dialkylhydrogensilyl terminated polydialkylsiloxane and atrialkylsilyl terminated polydialkylsiloxane-alkylhydrogensiloxaneco-polymer. The dialkylhydrogensilyl terminated polydialkylsiloxane ofthis embodiment may be further defined as dimethylhydrogensilylterminated polydimethylsiloxane and the trialkylsilyl terminatedpolydialkylsiloxane-alkylhydrogensiloxane co-polymer of this embodimentmay be further defined as a trimethylsilyl terminatedpolydimethylsiloxane-methylhydrogensiloxane co-polymer.

Referring back, the silicone composition also typically includes ahydrosilylation catalyst used to accelerate a hydrosilylation reactionbetween the organosilicon compound and the organohydrogensiliconcompound. The hydrosilylation catalyst can be any of the well-knownhydrosilylation catalysts comprising a platinum group metal (i.e.,platinum, rhodium, ruthenium, palladium, osmium and iridium) or acompound containing a platinum group metal. Typically, the platinumgroup metal is platinum, based on its high activity in hydrosilylationreactions.

Specific hydrosilylation catalysts suitable for use include thecomplexes of chloroplatinic acid and certain vinyl-containingorganosiloxanes disclosed by Willing in U.S. Pat. No. 3,419,593, theportions of which address hydrosilylation catalysts are herebyincorporated by reference. A catalyst of this type is the reactionproduct of chloroplatinic acid and1,3-diethenyl-1,1,3,3-tetramethyldisiloxane.

The hydrosilylation catalyst can also be a supported hydrosilylationcatalyst comprising a solid support having a platinum group metal on thesurface thereof. A supported catalyst can be conveniently separated fromthe silicone composition by filtration. Examples of supported catalystsinclude, but are not limited to, platinum on carbon, palladium oncarbon, ruthenium on carbon, rhodium on carbon, platinum on silica,palladium on silica, platinum on alumina, palladium on alumina, andruthenium on alumina.

It is contemplated that the hydrosilylation catalyst may be amicroencapsulated platinum group metal-containing catalyst comprising aplatinum group metal encapsulated in a thermoplastic resin. Siliconecompositions including microencapsulated hydrosilylation catalysts arestable for extended periods of time, typically several months or longer,under ambient conditions, yet cure relatively rapidly at temperaturesabove the melting or softening point of the thermoplastic resin(s).Microencapsulated hydrosilylation catalysts and methods of preparingthem are well known in the art, as exemplified in U.S. Pat. No.4,766,176 and the references cited therein, and U.S. Pat. No. 5,017,654.The hydrosilylation catalyst of this invention can be a single catalystor a mixture comprising two or more different catalysts that differ inat least one property, such as structure, form, platinum group metal,complexing ligand, and thermoplastic resin.

In one embodiment, the hydrosilylation catalyst includes at least onephotoactivated hydrosilylation catalyst. The photoactivatedhydrosilylation catalyst can be any hydrosilylation catalyst capable ofcatalyzing the hydrosilylation of the organosilicon compound and theorganohydrogensilicon compound upon exposure to radiation having awavelength of from 150 to 800 nm. The photoactivated hydrosilylationcatalyst can be any of the well-known hydrosilylation catalystscomprising a platinum group metal or a compound containing a platinumgroup metal. The platinum group metals include platinum, rhodium,ruthenium, palladium, osmium, and iridium. Typically, the platinum groupmetal is platinum, based on its high activity in hydrosilylationreactions.

Specific examples of photoactivated hydrosilylation catalysts suitablefor purposes of the present invention include, but are not limited to,platinum(II) β-diketonate complexes such as platinum(II)bis(2,4-pentanedionate), platinum(II) bis(2,4-hexanedionate),platinum(II) bis(2,4-heptanedionate), platinum(II)bis(1-phenyl-1,3-butanedionate, platinum(II) bis(1,3-diphenyl-1,3-propanedionate), platinum(II)bis(1,1,1,5,5,5-hexafluoro-2,4-pentanedioate);(η-cyclopentadienyl)trialkylplatinum complexes, such as(Cp)trimethylplatinum, (Cp)ethyldimethylplatinum, (Cp)triethylplatinum,(chloro-Cp)trimethylplatinum, and (trimethylsilyl-Cp)trimethylplatinum,where Cp represents cyclopentadienyl; triazene oxide-transition metalcomplexes, such as Pt[C₆H₅NNNOCH₃]₄, Pt[p-CN—C₆H₄NNNOC₆H₁₁]₄,Pt[p-H₃COC₆H₄NNNOC₆H₁₁]₄, Pt[p-CH₃(CH₂)_(x)—C₆H₄NNNOCH₃]₄,1,5-cyclooctadiene Pt[p-CN—C₆H₄NNNOC₆H₁₁]₂,1,5-cyclooctadiene.Pt[p-CH₃O—C₆H₄NNNOCH₃]₂,[(C₆H₅)₃P]₃Rh[p-CN—C₆H₄NNNOC₆H₁₁], and Pd[p-CH₃(CH₂)_(x)—C₆H₄NNNOCH₃]₂,where x is 1, 3, 5, 11, or 17; (η-diolefin)(σ-aryl)platinum complexes,such as (η⁴-1,5-cyclooctadienyl)diphenylplatinum,θ⁴-1,3,5,7-cyclooctatetraenyl)diphenylplatinum,(η⁴-2,5-norboradienyl)diphenylplatinum,(η⁴-1,5-cyclooctadienyl)bis-(4-dimethylaminophenyl)platinum,(η⁴-1,5-cyclooctadienyl)bis-(4-acetylphenyl)platinum, and(η⁴-1,5-cyclooctadienyl)bis-(4-trifluormethylphenyl)platinum. Typically,the photoactivated hydrosilylation catalyst is a Pt(II) β-diketonatecomplex and more typically the catalyst is platinum(II)bis(2,4-pentanedioate). The hydrosilylation catalyst can be a singlephotoactivated hydrosilylation catalyst or a mixture comprising two ormore different photoactivated hydrosilylation catalysts.

Methods of preparing photoactivated hydrosilylation catalysts are wellknown in the art. For example, methods of preparing platinum(II)β-diketonates are reported by Guo et al. (Chemistry of Materials, 1998,10, 531-536). Methods of preparing (η-cyclopentadienyl)-trialkylplatinumcomplexes are disclosed in U.S. Pat. No. 4,510,094. Methods of preparingtriazene oxide-transition metal complexes are disclosed in U.S. Pat. No.5,496,961. Methods of preparing (η-diolefin)(σ-aryl)platinum complexesare taught in U.S. Pat. No. 4,530,879.

The concentration of hydrosilylation catalyst is sufficient to catalyzethe hydrosilylation of the organosilicon compound and theorganohydrogensilicon compound. Typically, the concentration of thehydrosilylation catalyst is sufficient to provide from 0.1 to 1000 ppmof a platinum group metal, alternatively from 1 to 500 ppm of a platinumgroup metal, alternatively from 3 to 150 ppm of a platinum group metal,and alternatively from 1 to 25 ppm of a platinum group metal, based onthe combined weight of the organosilicon compound and theorganohydrogensilicon compound. One particularly suitable catalystincludes 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane platinum complexes.The catalysts may be included in amounts as determined by one of skillin the art. In one embodiment, the catalyst is included in the siliconecomposition in an amount of from 0.05 to 0.30 parts by weight per 100parts by weight of the silicone composition.

The silicone composition also typically includes a ratio ofsilicon-bonded hydrogen atoms per molecule of the organohydrogensiliconcompound to unsaturated moieties per molecule of the organosiliconcompound of from 0.05 to 100. In alternative embodiments, the ratio isfrom 0.1 to 100, 0.05 to 20, 0.05 to 0.7, 0.1 to 0.8, 0.1 to 0.6, 0.5 to2, 1.5 to 5, 1.75 to 3, 2 to 2.5, and from 0.95 to 1.05. In variousembodiments, there is a stoichiometric excess of silicon bonded hydrogenatoms to unsaturated moieties which may enhance adhesion between thefirst outermost layer 22 and the second (outermost) layer 26 or a tielayer 30, described in greater detail below. Of course, it is to beunderstood that the above referenced ratios do not limit this inventionso long as the ratio is between 0.05 to 100.

As first introduced above, the second (outermost) layer 26 may be freeof the plurality of fibers 27 or may include the plurality of fibers 27.In one embodiment, the silicone composition used to form the second(outermost) layer 26 is further defined as a hydrosilylation-curablesilicone composition which may coat the plurality of fibers 27, asdescribed above. Typically, this hydrosilylation-curable siliconecomposition is liquid, i.e., flows at room temperature. Thehydrosilylation-curable silicone composition may include a filler or befree of the filler. Conversely, the hydrosilylation-curable siliconecomposition may include both the plurality of fibers 27 and the filler.

The hydrosilylation-curable silicone composition includes a linearorganosilicon compound having two terminal unsaturated moieties permolecule, a branched organosilicon compound having two terminalunsaturated moieties per molecule and at least one pendant unsaturatedmoiety per molecule, and an organohydrogensilicon compound having atleast one silicon-bonded hydrogen atom per molecule. In one embodiment,the organohydrogensilicon compound has at least two silicon-bondedhydrogen atoms per molecule. In another embodiment, theorganohydrogensilicon compound has at least three silicon-bondedhydrogen atoms per molecule.

The hydrosilylation-curable silicone composition also typically includesthe filler, introduced above, and a hydrosilylation catalyst used toaccelerate a hydrosilylation reaction between the linear organosiliconcompound, the branched organosilicon compound, and theorganohydrogensilicon compound. Various hydrosilylation catalysts thatcan be utilized in this embodiment are described above. In thisembodiment, the linear organosilicon compound is present in an amount offrom 80 to 95 parts by weight and the branched organosilicon compound ispresent in an amount of from 5 to 20 as parts by weight, per 100 partsby weight of a sum of the linear organosilicon compound and the branchedorganosilicon compound. In other embodiments, the linear organosiliconcompound is present in an amount of from 85 to 95, from 86 to 94, from88 to 90, from 90 to 95, or from 92 to 94, or of about 80, 86, 90, or93, parts by weight, per 100 parts by weight of a sum of the linearorganosilicon compound and the branched organosilicon compound. In stillother embodiments, the branched organosilicon compound is present in anamount of from 5 to 15, from 7 to 10, from 7 to 14, from 10 to 20, or ofabout 7, 10, 14, or 20, parts by weight, per 100 parts by weight of asum of the linear organosilicon compound and the branched organosiliconcompound. It is to be understood that the linear and/or branchedorganosilicon compounds may each be independently utilized in any amountor range of amounts within those ranges described above.

Also, in the hydrosilylation-curable silicone composition, a ratio ofsilicon-bonded hydrogen atoms per molecule of the organohydrogensiliconcompound to a sum of unsaturated moieties per molecule of the linearorganosilicon compound and the branched organosilicon compound is from 1to 1.7, typically from 1.1 to 1.6 or from 1.1 to 1.2. In variousembodiments, the ratio is from 1.5 to 1.55.

The hydrosilylation-curable silicone composition may include a firstportion and a second portion when used. The linear organosiliconcompound, the branched organosilicon compound, and theorganohydrogensilicon compound may be present in the first portion, thesecond portion, or in both the first and second portions. In oneembodiment, the linear organosilicon compound, the branchedorganosilicon compound, and the organohydrogensilicon compound are notall present in one portion due to a potential to prematurely react. Inanother embodiment, the organosilicon compound, the branchedorganosilicon compound, and the organohydrogensilicon compound are allpresent in one portion but are not present with a hydrosilylationcatalyst. In still another embodiment, the linear and branchedorganosilicon compounds are present in the first portion and theorganohydrogensilicon compound and the hydrosilylation catalyst arepresent in the second portion. In still other embodiments, the linearorganosilicon compound and/or the branched organosilicon compound arepresent in both the first and second portions while the hydrosilylationcatalyst is present in the first portion and the organohydrogensiliconcompound is present in the second portion. Typically, any cross-linkeror chain extender is present in the second portion without the catalyst.In various embodiments, the first and second portions have varyingviscosities of from 200 to 15,000 cps at 25° C. determined according toASTM D4287. In other embodiments, the first and second portions haveapproximate viscosities as follows: 289, 289, 1449, 2000, 2064, 3440,4950, 5344, 8,194, 11,212, 12,680, and 14,129, cps at 25° C. determinedaccording to ASTM D4287.

The linear organosilicon compound may be any of the compounds describedabove or may be different so long as the linear organosilicon compoundhas two terminal unsaturated moieties per molecule. Typically, thelinear organosilicon compound has exactly two terminal unsaturatedmoieties per molecule. The linear organosilicon compound does not havependant unsaturated moieties. In various embodiments, the linearorganosilicon compound is further defined as a vinyl end-blockedpolydialkylsiloxane, e.g. a vinyl end-blocked polydimethylsiloxane thathas two terminal vinyl groups. In other embodiments, the linearorganosilicon compound has an average degree of polymerization (DP) offrom 150 to 900, a weight average molecular weight of from 11,000 to63,000, a viscosity of from 400 to 60,000 cps at 25° C. determinedaccording to ASTM D4287, and a weight percent of vinyl groups of from0.01 to 10. In still other embodiments, the linear organosiliconcompound has the following physical properties ±1%, ±3%, ±5%, ±10%,±15%, ±20%, or ±25%. It is also contemplated that the linearorganosilicon compound may have other physical properties not set forthbelow.

Weight Avg. Viscosity Various Average Mol. Wt. (cps at Wt. % VinylEmbodiments DP (g/mol) 25° C.) Groups Vinyl End-Blocked 297 22,000 2,1000.21 Polydimethylsiloxane Vinyl End-Blocked 155 11,500 450 0.46Polydimethylsiloxane Vinyl End-Blocked 837 62,000 55,000 0.088PolydimethylsiloxaneIt is also contemplated that the hydrosilylation-curable siliconecomposition may include more than one linear organosilicon compound thatis described above. Additional linear organosilicon compounds that arecontemplated for use in this invention are described in U.S. Pat. No.5,574,073, which is expressly incorporated herein by reference.

The branched organosilicon compound may also be any of the compoundsdescribed above or may be different so long as the branchedorganosilicon compound has two terminal unsaturated moieties permolecule and at least one pendant unsaturated moiety per molecule. Invarious embodiments, the branched organosilicon compound is furtherdefined as a vinyl end-blocked polydialkylsiloxane having at least onevinyl pendant group, e.g. a vinyl end-blocked polydimethylsiloxanehaving two terminal vinyl groups and at least one vinyl pendant group.In other embodiments, the branched organosilicon compound has an averagedegree of polymerization (DP) of from 100 to 800, a weight averagemolecular weight of from 8,000 to 60,000, a viscosity of from 200 to30,000 cps at 25° C. determined according to ASTM D4287, and a weightpercent of vinyl groups of from 0.1 to 10. In one embodiment, thebranched organosilicon compound has an average degree of polymerization(DP) of about 620, a weight average molecular weight of about 46,000g/mol, a viscosity of about 15,000 cps at 25° C. determined according toASTM D4287, and a weight percent of vinyl groups of about 7.7. It isalso contemplated that the hydrosilylation-curable silicone compositionmay include more than one branched organosilicon compound that isdescribed above. Additional branched organosilicon compound that arecontemplated for use in this invention are described in U.S. Pat. No.5,574,073, which is expressly incorporated herein by reference.

It is to be understood that the terminology “silicone composition” and“hydrosilylation-curable silicone composition,” when used herein, areinterchangeable so long as the hydrosilylation-curable siliconecomposition remains as described above. Said differently, thisterminology is interchangeable so long as the hydrosilylation-curablesilicone composition includes a linear organosilicon compound having twoterminal unsaturated moieties per molecule, a branched organosiliconcompound having two terminal unsaturated moieties per molecule and atleast one pendant unsaturated moiety per molecule, and anorganohydrogensilicon compound having at least one silicon-bondedhydrogen atom per molecule.

The silicone composition may also include a silicone rubber having aformula selected from the group of (a) R¹R² ₂SiO(R² ₂SiO)_(a)SiR² ₂R¹and (b) R⁵R¹ ₂SiO(R¹R⁵SiO)_(b)SiR¹ ₂R⁵; wherein R¹ and R² are as definedand exemplified above, R⁵ is R¹ or —H, subscripts a and b each have avalue of from 1 to 4, alternatively from 2 to 4, alternatively from 2 to3, and w, x, y, and z are also as defined and exemplified above.Specific examples of silicone rubbers suitable for use as siliconerubber (a) include, but are not limited to, silicone rubbers having thefollowing formulae:

ViMe₂SiO(Me₂SiO)_(a)SiMe₂Vi,

ViMe₂SiO(Ph₂SiO)_(a)SiMe₂Vi, and

ViMe₂SiO(PhMeSiO)_(a)SiMe₂Vi

wherein Me is methyl, Ph is phenyl, Vi is vinyl, and the subscript has avalue of from 1 to 4. Silicone rubber (a) can be a single siliconerubber or a mixture comprising two or more different silicone rubbersthat each satisfy the formula for (a).

Specific examples of silicone rubbers suitable for use as siliconerubber (b) include, but are not limited to, silicone rubbers having thefollowing formulae:

HMe₂SiO(Me₂SiO)_(b)SiMe₂H,

HMe₂SiO(Ph₂SiO)_(b)SiMe₂H,

HMe₂SiO(PhMeSiO)_(b)SiMe₂H, and

HMe₂SiO(Ph₂SiO)₂(Me₂SiO)₂SiMe₂H

wherein Me is methyl, Ph is phenyl, and the subscript b has a value offrom 1 to 4. Component (b) can be a single silicone rubber or a mixturecomprising two or more different silicone rubbers that each satisfy theformula for (b).

In other embodiments of the present invention, the silicone compositionincludes a rubber-modified silicone resin prepared by reacting theorganosilicon compound and at least one silicone rubber (b) selectedfrom rubbers having the following formulae:

R⁵R¹ ₂SiO(R¹R⁵SiO)_(c)SiR¹ ₂R⁵, and

R¹R² ₂SiO(R² ₂SiO)_(d)SiR² ₂R¹,

wherein R¹ and R⁵ are as defined and exemplified above and c and d eachhave a value of from 4 to 1000, alternatively from 10 to 500,alternatively from 10 to 50, in the presence of the hydrosilylationcatalyst and, optionally, an organic solvent, provided that the reactionproduct of the organosilicon compound and the silicone rubber (b) has atleast one unsaturated moiety per molecule.

In one embodiment, the silicone composition includes from 45 to 90 partsby weight of a dimethylvinylsiloxy-terminated dimethylsiloxane, from 0.5to 2 parts by weight of an alkoxysilane, 0.5 to 2 parts by weight of amethacryloxypropyltrimethoxysilane, from 0.01 to 0.2 parts by weight oftetramethyltetravinycyclotetrasiloxane, from 2 to 10 parts by weight ofa hydrogen terminated dimethylsiloxane, from 0.2 to 1 parts by weight ofdimethylmethylhydrogensiloxane, and from 0.01 to 0.1 parts by weight of1,3-diethenyl-1,1,3,3-tetramethyldisiloxane platinum complexes. Inanother embodiment, the silicone composition includes from 45 to 90parts by weight of a dimethylvinylsiloxy-terminated dimethylsiloxanes,from 0.5 to 2 parts by weight of an alkoxysilane, 0.5 to 2 parts byweight of a methacryloxypropyltrimethoxysilane, from 0.01 to 0.2 partsby weight of tetramethyltetravinycyclotetrasiloxane, from 2 to 10 partsby weight of a hydrogen terminated dimethylsiloxane, from 0.2 to 1 partsby weight of dimethylmethylhydrogensiloxane, from 20 to 60 parts byweight of quartz, and from 0.01 to 0.1 parts by weight of1,3-diethenyl-1,1,3,3-tetramethyldisiloxane platinum complexes.

The silicone composition may also include a solvent, e.g. an organicsolvent. The organic solvent can be any aprotic or dipolar aproticorganic solvent that does not react with, and is miscible with, theorganosilicon compound and the organohydrogensilicon compound.Non-limiting examples of suitable organic solvents include saturatedaliphatic hydrocarbons such as n-pentane, hexane, n-heptane, isooctaneand dodecane, cycloaliphatic hydrocarbons such as cyclopentane andcyclohexane, aromatic hydrocarbons such as benzene, toluene, xylene andmesitylene, cyclic ethers such as tetrahydrofuran (THF) and dioxane,ketones such as methyl isobutyl ketone (MIBK), halogenated alkanes suchas trichloroethane, halogenated aromatic hydrocarbons such asbromobenzene and chlorobenzene, and combinations thereof. The organicsolvent may be a single organic solvent or a mixture comprising two ormore different organic solvents, each as described above. Theconcentration of the organic solvent in the silicone composition may befrom 0 to 99% (w/w), alternatively from 30 to 80% (w/w), andalternatively from 45 to 60% (w/w), based on the total weight of thesilicone composition.

The silicone composition may also include the filler, as firstintroduced above. The filler may be used to dissipate heat from themodule 20. The filler may be any known in the art and may include asingle filler or a combination of fillers. The filler may be thermallyand/or electrically conductive or insulating. The filler may be furtherdefined as a reinforcing filler, an extending filler, a thixotropicfiller, a pigment, or a combination thereof. The filler may include oneor more finely divided reinforcing fillers such as high surface areafumed and precipitated silicas, zinc oxide, aluminum, aluminum powder,aluminum tri-hydrate, silver, calcium carbonate, and/or additionalextending fillers such as quartz, diatomaceous earths, barium sulfate,iron oxide, titanium dioxide and carbon black, talc, wollastonite,aluminite, calcium sulfate (anhydrite), gypsum, calcium sulfate,magnesium carbonate, clays such as kaolin, aluminum trihydroxide,magnesium hydroxide (brucite), graphite, copper carbonate such asmalachite, nickel carbonate such as zarachite, barium carbonate such aswitherite, strontium carbonate such as strontianite, aluminum oxide,silicates including, but not limited to, olivine groups, garnet groups,aluminosilicates, ring silicates, chain silicates, and sheet silicates,and combinations thereof. The olivine groups may include, but are notlimited to, forsterite, Mg₂SiO₄, and combinations thereof. Non-limitingexamples of the garnet groups may include pyrope, Mg₃Al₂Si₃O₁₂,grossular, Ca₂Al₂Si₃O₁₂, and combinations thereof. The aluminosilicatesmay include, but are not limited to, sillimanite, Al₂SiO₅, mullite,3Al₂O₃.2SiO₂, kyanite, Al₂SiO₅ and combinations thereof. The ringsilicates may include, but are not limited to, cordierite,Al₃(MgFe)₂[Si₄AlO₁₈], and combinations thereof. The chain silicates mayinclude, but are not limited to, wollastonite, Ca[SiO₃], andcombinations thereof. Suitable examples of the sheet silicates that arenot limiting may include mica, K₂Al₁₄[Si₆Al₂O₂₀](OH)₄, pyrophyllite,Al₄[Si₈O₂₀](OH)₄, talc, Mg₆[Si₈O₂₀](OH)₄, serpentine, asbestos,Kaolinite, Al₄[Si₄O₁₀](OH)₈, vermiculite, and combinations thereof. Lowdensity fillers may also be included to reduce weight and cost pervolume. The fillers may include particles that are smaller than ¼ of thewavelength of light to avoid scattering but this is not required. Thus,fillers such as wollastonite, silica, titanium dioxide, glass fibers,hollow glass spheres and clays e.g. kaolin are particularly preferred.

In one embodiment, the filler is selected from the group consisting ofaluminum nitride, aluminum oxide, aluminum trihydrate, barium titanate,beryllium oxide, boron nitride, carbon fibers, diamond, graphite,magnesium hydroxide, magnesium oxide, metal particulate, onyx, siliconcarbide, silicon, tungsten carbide, zinc oxide, and a combinationthereof. The filler may be further defined as a metallic filler, aninorganic filler, a meltable filler, or a combination thereof. Metallicfillers include particles of metals and particles of metals havinglayers on the surfaces of the particles. These layers may be, forexample, metal nitride layers or metal oxide layers on the surfaces ofthe particles. Suitable metallic fillers are exemplified by particles ofmetals selected from aluminum, copper, gold, nickel, silver, andcombinations thereof, and alternatively aluminum. Suitable metallicfillers are further exemplified by particles of the metals describedabove having layers on their surfaces selected from aluminum nitride,aluminum oxide, copper oxide, nickel oxide, silver oxide, andcombinations thereof. For example, metallic filler may include aluminumparticles having aluminum oxide layers on their surfaces.

Suitable inorganic fillers include, but are not limited to, onyx,aluminum trihydrate, metal oxides such as aluminum oxide, berylliumoxide, magnesium oxide, and zinc oxide, nitrides such as aluminumnitride and boron nitride, carbides such as silicon carbide and tungstencarbide.

Suitable meltable fillers include, but are not limited to, Bi, Ga, In,Sn, Ag, Au, Cd, Cu, Pb, Sb, Zn, alloys thereof, and combinationsthereof. Non-limiting examples of suitable meltable fillers include Ga,In—Bi—Sn alloys, Sn—In—Zn alloys, Sn—In—Ag alloys, Sn—Ag—Bi alloys,Sn—Bi—Cu—Ag alloys, Sn—Ag—Cu—Sb alloys, Sn—Ag—Cu alloys, Sn—Ag alloys,Sn—Ag—Cu—Zn alloys, and combinations thereof. The meltable filler mayhave a melting point ranging from 50° C. to 250° C. or from 150° C. to225° C. The meltable filler may be a eutectic alloy, a non-eutecticalloy, or a pure metal. Suitable meltable fillers are commerciallyavailable from Indium Corporation of America, of Utica, N.Y., Arconium,of Providence, R.I., and AIM Solder of Cranston, R.I. Suitable aluminumfillers are commercially available from Toyal America, Inc. ofNaperville, Ill. and Valimet Inc. of Stockton, Calif. Silver fillers arecommercially available from Metalor Technologies U.S.A. Corp. ofAttleboro, Mass.

Additional examples of suitable fillers include, but are not limited to,precipitated calcium carbonate, ground calcium carbonate, fumed silica,precipitated silica, talc, titanium dioxide, plastic powders, glass orplastic (such as Saran™) microspheres, high aspect ratio fillers such asmica or exfoliated mica, and combinations thereof. The filler mayoptionally be treated with a treating agent, such as a fatty acid (e.g.,stearic acid). Precipitated calcium carbonate is available from Solvayunder the trade name WINNOFIL® SPM. Ground calcium carbonate isavailable from QCI Britannic of Miami, Fla., U.S.A. under the trade nameImerys Gammasperse. Carbon black, such as 1011, is commerciallyavailable from Williams. Silica is commercially available from CabotCorporation.

The filler may be further defined as a single thermally conductivefiller or a combination of two or more thermally conductive fillers thatdiffer in at least one property such as particle shape, average particlesize, particle size distribution, and type of filler. For example, itmay be desirable to use a combination of inorganic fillers, such as afirst aluminum oxide having a larger average particle size and a secondaluminum oxide having a smaller average particle size. Alternatively, itmay be desirable, for example, use a combination of an aluminum oxidehaving a larger average particle size with a zinc oxide having a smalleraverage particle size. Alternatively, it may be desirable to usecombinations of metallic fillers, such as a first aluminum having alarger average particle size and a second aluminum having a smalleraverage particle size. For example, the first aluminum may have anaverage particle size ranging from 8 micrometers to 100 micrometers,alternatively 8 micrometers to 10 micrometers. The second aluminum mayhave an average particle size ranging from 0.1 micrometer to 5micrometers, alternatively 1 micrometer to 3 micrometers. Alternatively,it may be desirable to use combinations of metallic and inorganicfillers, such as a combination of metal and metal oxide fillers, e.g., acombination of aluminum and aluminum oxide fillers; a combination ofaluminum and zinc oxide fillers; or a combination of aluminum, aluminumoxide, and zinc oxide fillers. Using a first filler having a largeraverage particle size and a second filler having a smaller averageparticle size than the first filler may improve packing efficiency, mayreduce viscosity, and may enhance heat transfer. It is contemplated thatany of the above fillers may be used in combination if desired.

An average particle size of thermally conductive fillers depends onvarious factors including the type of thermally conductive filler andthe amount used. However, in various embodiments, the thermallyconductive filler has an average particle size ranging from 0.1micrometer to 100 micrometers, alternatively 0.1 micrometer to 80micrometers, alternatively 0.1 micrometer to 50 micrometers, andalternatively 0.1 micrometer to 10 micrometers.

In various embodiments, the silicone composition includes from 10 to 70,from 20 to 60, from 40 to 60, or from 30 to 50, parts by weight of thefiller per 100 parts by weight of the silicone composition. In oneembodiment, the silicone composition includes from 45 to 55 parts byweight of a quartz filler per 100 parts by weight of the siliconecomposition. In an additional embodiment, the silicone compositionincludes from 1 to 150 parts by weight of a filler per 100 parts byweight of the silicone composition. In a further embodiment, thesilicone composition includes about 50 parts by weight of a quartzfiller per 100 parts by weight of the silicone composition. In yetanother embodiment, the silicone composition includes a filler selectedfrom the group of quartz, silicon, aluminum oxide, aluminum tri-hydrate,and combinations thereof present in an amount of from 10 to 80 parts byweight per 100 parts by weight of the silicone composition.

The aforementioned fillers may be surface treated with fatty acids orfatty acid esters such as stearates, organosilanes, organosiloxanes,organosilazanes such as hexaalkyl disilazane, and/or short chainsiloxane diols, and combinations thereof to render the fillerhydrophobic. This surface treatment may make the fillers easier tohandle and obtain a homogeneous mixture with the other components of thesilicone composition. The surface treatment may also make groundsilicate minerals easily wetted. Without intending to be limited, it isbelieved that the surface modified fillers resist clumping and can behomogeneously incorporated into the silicone composition, thus resultingin improved room temperature mechanical properties. Furthermore, it isbelieved that the surface treated fillers are less electricallyconductive than non-treated fillers. As described above, a heatconducting filler may be used when the first outermost layer 22 is alsothermally conductive thus enabling the removal of excess heat from thephotovoltaic cells 24 which improves cell efficiency.

In addition to the fillers, the silicone composition may also include anadditive such as a hydrosilylation catalyst inhibitor such as3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne,3,5-dimethyl-1-hexyn-3-ol, 1-ethynyl-1-cyclohexanol,2-phenyl-3-butyn-2-ol, vinylcyclosiloxanes, and triphenylphosphine.Other non-limiting examples of additives include pigments, adhesionpromoters, corrosion inhibitors, dyes, diluents, anti-soiling additives,and combinations thereof. Inclusion of such additives may be based onshelf-life, cure kinetics and optical properties of the tie layer 26.

Particularly preferred examples of suitable adhesion promoters mayinclude, but are not limited to, vinyltriethoxysilane,acrylopropyltrimethoxysilanes, alkylacrylopropyltrimethoxysilanes suchas methacryloxypropyltrimethoxysilane, alkoxysilanes,allyltriethoxysilane, glycidopropyltrimethoxysilane, allylglycidylether,hydroxydialkyl silyl terminated methylvinylsiloxane-dimethylsiloxanecopolymer, a reaction product of hydroxydialkyl silyl terminatedmethylvinylsiloxane-dimethylsiloxane copolymer withglycidopropyltrimethoxysilane, bis-triethoxysilyl ethylene glycol,hydroxydialkyl silyl terminated methylvinylsiloxane-dimethylsiloxanecopolymer, a reaction product of hydroxydialkyl silyl terminatedmethylvinylsiloxane-dimethylsiloxane copolymer withglycidopropyltrimethoxysilane and bis-triethoxysilyl ethylene glycol, a0.5:1 to 1:2, and more typically a 1:1 mixture of the hydroxydialkylsilyl terminated methylvinylsiloxane-dimethylsiloxane copolymer and amethacrylopropyltrimethoxysilane, and combinations thereof.

As described above, the additive may include anti-soiling additives toreduce/prevent soiling when the photovoltaic cells 24 are in use.Particularly preferred anti-soiling additives include, but are notlimited to, fluoroalkenes and fluorosilicones that have viscosities of10,000 mPa·s at 25° C. such as fluorinated silsesquioxanes includingdimethylhydrogensiloxy terminated trifluoropropyl silsesquioxane,hydroxy-terminated trifluoropropylmethyl siloxane, hydroxy-terminatedtrifluoropropylmethylsilyl methylvinylsilyl siloxane,3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyltriethoxysilane,hydroxy-terminated methylvinyl, trifluoropropylsiloxane,dimethylhydrogensiloxy-terminated dimethyl trifluoropropylmethylsiloxane, and combinations thereof. The anti-soiling additive istypically present in an amount of 5 or less parts by weight per 100parts by weight of the silicone composition.

The silicone composition may also include optical brighteners capable ofabsorbing solar energy at the lower wavelengths (200-500 nm) andre-emitting at higher wavelengths (600-900 nm), rheological modifiers,pigments, heat stabilizers, flame retardants, UV stabilizers, chainextenders, plasticizers, extenders, fungicides and/or biocides and thelike (which may be present in an amount of from 0 to 0.3% by weight),water scavengers, pre-cured silicone and/or organic rubber particles toimprove ductility and maintain low surface tack, and combinationsthereof.

Suitable examples of the fire retardants include alumina powder orwollastonite as described in WO 00/46817, which is expresslyincorporated herein by reference relative to these fire retardants. Thefire retardant may be used alone or in combination with other fireretardants or a pigment such as titanium dioxide.

Any reactions of this invention, such as hydrosilylation reactions, maybe carried out in any standard reactor suitable or may occur on themodule 22. Suitable reactors include glass and Teflon-lined glassreactors. Typically, the reactor is equipped with a means of agitation,such as stirring. The reaction is typically carried out in an inertatmosphere, such as nitrogen or argon, in the absence of moisture.

The silicone composition of this invention may be tacky or non-tacky andmay be a gel, gum, liquid, paste, resin, or solid. In the method of thisinvention, the silicone composition is liquid and is disposed on thephotovoltaic cell 24. In one embodiment, the silicone composition is afilm. In another embodiment, the silicone composition is a gel. In yetanother embodiment, the silicone composition is a liquid that is cured(e.g. pre-cured or partially cured) to form a gel. Alternatively, thesilicone composition may include multiple segments, with each segmentincluding a different silicone and/or different form (e.g. gel andliquid). In one embodiment, the silicone composition consistsessentially of the organosilicon compound, the organohydrogensiliconcompound, and the hydrosilylation catalyst and does not include anyadditional silicones, fillers, cross-linkers, and/or additives.Alternatively, the silicone composition may consist of the organosiliconcompound, the organohydrogensilicon compound, and the hydrosilylationcatalyst.

The silicone composition may be uncured, partially cured, or completelycured via a hydrosilylation mechanism or any of the other mechanismsintroduced above. In one embodiment, the silicone composition is curedat a temperature of from 0° C. to 150° C. Alternatively, the siliconecomposition may be cured at a temperature of from 50° C. to 150° C. orat a temperature of from room temperature (˜23° C.±2° C.) to 115° C.However, other temperatures may be used, as selected by one of skill inthe art. If the silicone composition is cured with heat, heating mayoccur in any suitable oven or the like in either a batch or continuousmode. A continuous mode is most preferred. Additionally, the siliconecomposition may be cured for a time of from 1 to 24 hours. However, thesilicone composition may be cured for a shorter or longer time, asselected by one of skill in the art depending on application. In variousembodiments, the silicone composition has a viscosity of less than about100,000, from 50 to 10,000, from 100 to 7,500, from 250 to 5,000, from250 to 10,000, from 25 to 800, from 2,500 to 5,000, from 250 to 600,from 3,000 to 4,000, or from 2,000 to 8,000 centipoise (cps) at 25° C.In alternative embodiments, the silicone composition has a viscosity ofabout 400 or about 3,500 cps at 25° C. The viscosity of the siliconecomposition may be calculated using ASTM D1084 or ASTM D4287.

Referring back, in one embodiment, as set forth in FIG. 7, the pluralityof fibers 27 at least partially coated with the silicone compositionextends laterally (L), i.e., in a lateral direction, across the second(outermost) layer 26 to a periphery (36) of the module 20 on both endsof the module. In one embodiment, the plurality of fibers 27 at leastpartially coated with the silicone composition extends laterally (L)across the second (outermost) layer 26 to the periphery (36) of themodule 20 at all ends of the module. The terminology “ends”, as usedherein, includes the front, rear, and/or side periphery of the module20. The plurality of fibers 27 may completely extend from one end of themodule 20 to the other. The plurality of fibers 27 may be coated in somesections and not coated in others or may be completely coated. In oneembodiment, uncoated fibers 27 extend across a portion of the second(outermost) layer 26 to the periphery 36 while coated fibers extendacross another portion of the second (outermost) layer 26. The pluralityof fibers 27 and/or the second (outermost) layer 26 may totally coverthe photovoltaic cell 24 when disposed on the photovoltaic cell 24.Alternatively, the plurality of fibers 27 and/or the second (outermost)layer 26 may not totally cover the photovoltaic cell 26 when disposedthereon and may leave gaps.

The second (outermost) layer 26 including the plurality of fibers 27 istypically the same size as the first outermost layer 22 and thephotovoltaic cell 24. However, in one embodiment, the second (outermost)layer 26 is smaller than the photovoltaic cell 24 and only extends overa portion of the photovoltaic cell 24. In a further embodiment, thesecond (outermost) layer 26 has a length and width of 125 mm each. Inyet another embodiment the second (outermost) layer 26 has a length andwidth of 156 mm each. Of course it is to be understood that plurality offibers 27 and the second (outermost) layer 26, and the instantinvention, are not limited to these dimensions.

Referring back to the module 20, the module 20 may also include asupporting layer 28. The supporting layer 28 may be the same ordifferent than the first outermost layer 22. In one embodiment, thesupporting layer 28 is a second outermost layer disposed on the secondlayer 26 when the second layer 26 is an interior layer. In thisembodiment, the supporting layer 28 is disposed opposite the firstoutermost layer 22 and is used for supporting the module 20. In analternative embodiment, the supporting layer 28 includes glass. Inanother embodiment, the supporting layer 28 includes at least one of apolyimide, polyethylene, an ethylene-vinyl acetate copolymer, an organicfluoropolymer including, but not limited to, ethylenetetrafluoroethylene (ETFE), polyvinylfluoride (Tedlar®),polyester/Tedlar®, Tedlar®/polyester/Tedlar®, polyethylene terephthalate(PET) alone or at least partially coated with silicon and oxygen basedmaterials (SiO_(x)), and combinations thereof. In another embodiment,the supporting layer 28 includes Tedlar®. As is known in the art,Tedlar® is polyvinylfluoride. In one embodiment, the supporting layer 28is selected from the group of polyvinylfluoride and polyethylene.

Typically, the supporting layer 28 has a thickness of from 50 to 500,more typically of from 100 to 225, and most typically of from 175 to225, micrometers. In one embodiment, the supporting layer 28 has alength and width of 125 mm each. In another embodiment, the supportinglayer 28 has a length and width of 156 mm each. Of course it is to beunderstood that the supporting layer 28, and the instant invention, arenot limited to these dimensions.

In addition to the second (outermost) layer 26 and the supporting layer28, the module 20 may also include a tie layer 30. The tie layer 30 maybe disposed on the photovoltaic cell 24 and sandwiched between thephotovoltaic cell 24 and the first outermost layer 22. Alternatively,the tie layer 30 may be disposed in any other portion of the module 20.The module 20 may include more than one tie layer 30 and may includesecond, third, and/or additional tie layers. The second, third, and/oradditional tie layers may be the same or different than the tie layer30. The tie layer 30 may include a second silicone composition with maybe the same or different from the silicone composition described above.In one embodiment, the second silicone composition is different from thesilicone composition described above.

In one embodiment, as shown in FIGS. 3, 4, 10 and 11, the module 20includes the tie layer 30 disposed on the first outermost layer 22 andsandwiched between the first outermost layer 22 and the photovoltaiccell 24. The tie layer 30 may be transparent to UV and/or visible light,impermeable to light, or opaque.

The tie layer 30 may have a penetration of from 1.1 to 100 mm. Invarious embodiments, the tie layer 30 has a penetration of from 1.3 to100 mm and more typically of from 2 to 55 mm. The penetration isdetermined by first calculating hardness and then calculatingpenetration. Thus, the tie layer 30 typically has a hardness in grams(g) of Force of from 5 to 500, more typically of from 5 to 400, and mosttypically of from 10 to 300. More specifically, hardness is determinedusing a TA-XT2 Texture Analyzer commercially available from Stable MicroSystems using a 0.5 inch (1.27 cm) diameter steel probe. Test samples ofthe tie layer 30 having a mass of 12 g are heated at 100° C. for 10minutes and are analyzed for hardness using the following testingparameters, as known in the art: 2 mm/sec pre-test and post-test speed;1 mm/s test speed; 4 mm target distance; 60 second hold; and a 5 g forcetrigger value. The maximum grams force is measured at 4 mm distance intothe tie layer 30.

The tie layer 30 may also have a tack value of less than −0.6 g.sec. Invarious embodiments, the tie layer 30 has a tack value of from −0.7 to−300 g.sec and more typically of from −1 to −100 g.sec. In oneembodiment, the tie layer 30 has a tack value of about −27 g.sec. Thetack value is determined using a TA-XT2 Texture Analyzer commerciallyavailable from Stable Micro Systems using a 0.5 inch (1.27 cm) diametersteel probe. The probe is inserted into the tie layer 30 to a depth of 4mm and then withdrawn at a rate of 2 mm/sec. The tack value iscalculated as a total area (Force-Time) during withdrawal of the probefrom the tie layer 30. The tack value is expressed in gram.sec.

The tie layer 30 is typically tacky and may be a gel, gum, liquid,paste, resin, or solid. In one embodiment, the tie layer 30 is a film.In another embodiment, the tie layer 30 is a gel. In yet anotherembodiment, the tie layer 30 is a liquid that is cured (e.g. pre-cured)to form a gel. Alternatively, the tie layer 30 may include multiplesegments, with each segment including a different composition and/ordifferent form (e.g. gel and liquid), so long as the segments and theoverall tie layer 30 have the appropriate penetration and tack values,set forth above. Examples of suitable gels for use as the tie layer 30are described in U.S. Pat. Nos. 5,145,933, 4,340,709, and 6,020,409,each of which is expressly incorporated herein by reference relative tothese gels. It is to be understood that the tie layer 30 can have anyform. Typically, the tie layer 30 has a viscosity of from 10 to 100,000mPa·s measured at 25° C. according to ASTM D4287 using a BrookfieldDVIII Cone and Plate Viscometer. The tie layer 30 also typically has anelastic modulus (G′ at cure) of from 7×10² to 6×10⁵, dynes/cm².

In one embodiment, the tie layer 30 is substantially free of entrappedair (bubbles). The terminology “substantially free” means that the tielayer 30 has no visible air bubbles. In another embodiment, the tielayer 30 is totally free of entrapped air including both visible andmicroscopic air bubbles.

The tie layer 30 may be formed from any suitable compound known in theart. The tie layer 30 may be formed from and/or include an inorganiccompound, and organic compound, or a mixture of organic and inorganiccompounds. These compounds may or may not require curing. In oneembodiment, the tie layer 30 is formed from a curable compositionincluding silicon atoms. The tie layer 30 may be formed completely froma curable silicone composition such as those disclosed in U.S. Pat. Nos.6,020,409 and 6,169,155, herein expressly incorporated by referencerelative to these curable silicone compositions. In another embodiment,the curable composition of the tie layer 30 includes at least one of anethylene-vinyl acetate copolymer, a polyurethane, an ethylenetetrafluoroethylene, a polyvinylfluoride, a polyethylene terephthalate,and combinations thereof. Alternatively, the tie layer 30 may be formedfrom a curable composition including one or more of components (A)-(E).Component (A) may include any organic and/or inorganic compounds knownin the art and may include both carbon and silicon atoms. Typically,component (A) includes a diorganopolysiloxane. The diorganopolysiloxanemay have high number (M_(n)) and/or weight average (M_(w)) molecularweights and may be a silicone gum having at least two reactive groupsper molecule that are designed to cure with component (B), described ingreater detail below. Alternatively, the diorganopolysiloxane may be aresin or may include a gum and a resin. The diorganopolysiloxanetypically has a molecular structure which is substantially linear.However, this structure may be partially branched. In one embodiment,the diorganopolysiloxane is the same as the organosilicon compounddefined above. Of course, it is to be understood that component (A) maybe selected independently of the organosilicon compound.

Suitable examples of component (A) include, but are not limited to,dimethylalkenylsiloxy-terminated dimethylpolysiloxanes,dimethylalkenylsiloxy-terminated copolymers of methylalkenylsiloxane anddimethylsiloxane, dimethylalkenylsiloxy-terminated copolymers ofmethylphenylsiloxane and dimethylsiloxane,dimethylalkenylsiloxy-terminated copolymers of methylphenylsiloxane,methylalkenylsiloxane, and dimethylsiloxane,dimethylalkenylsiloxy-terminated copolymers of diphenylsiloxane anddimethylsiloxane, dimethylalkenylsiloxy-terminated copolymers ofdiphenylsiloxane, methylalkenylsiloxane, and dimethylsiloxane, andcombinations thereof.

Alternatively, component (A) may include a compound having hydroxyl orhydrolysable groups X and X¹ which may be the same or different. Thesegroups may or may not be terminal groups and are typically notsterically hindered. For example, this compound may have the generalformula:

X-A-X¹

wherein X and/or X¹ may include and/or terminate with any of thefollowing groups: —Si(OH)₃, —(R^(a))Si(OH)₂, —(R^(a))₂SiOH,—R^(a)Si(OR^(b))₂, —Si(OR^(b))₃, —R^(a) ₂SiOR^(b) or —R^(a)₂Si—R^(c)—SiR^(d) _(p)(OR^(b))_(3-p) where each R^(a) may independentlyinclude a monovalent hydrocarbyl group such as an alkyl group havingfrom 1 to 8 carbon atoms. Typically, R^(a) is a methyl group. Each R^(b)and R^(d) may independently be an alkyl group having up to 6 carbonatoms or alkoxy group. R^(c) is typically a divalent hydrocarbon groupwhich may include one or more siloxane spacers having up to six siliconatoms. Typically, p has a value 0, 1 or 2. In one embodiment, X and/orX¹ include functional groups which are hydrolysable in the presence ofmoisture.

Additionally, in this formula, (A) typically includes a siloxanemolecular chain. In one embodiment, (A) includes a polydiorgano-siloxanechain having siloxane units of the following formula

—(R⁶ _(s)SiO_((4-s)/2))—

wherein each R⁶ is independently an organic group such as a hydrocarbylgroup having from 1 to 10 carbon atoms that is optionally substitutedwith one or more halogen group such as chlorine or fluorine, and s is 0,1 or 2. More specifically, R⁶ may include methyl, ethyl, propyl, butyl,vinyl, cyclohexyl, phenyl, and/or tolyl groups, propyl groupssubstituted with chlorine or fluorine such as 3,3,3-trifluoropropyl,chlorophenyl, beta-(perfluorobutyl)ethyl or chlorocyclohexyl groups, andcombinations thereof. Typically, at least some of the groups R⁶ aremethyl groups. Most typically, all of the R⁶ groups are methyl groups.In one embodiment, there are at least approximately 700 units of theabove formula per molecule.

Typically, component (A) has a viscosity of greater than 50 mPa—s. Inone embodiment, component (A) has a viscosity of greater than 1,000,000mPa·s. In another embodiment, component (A) has a viscosity of 50 to1,000,000, more typically of from 100 to 250,000, and most typically offrom 100 to 100,000, mPa·s. Each of the aforementioned viscosities aremeasured at 25° C. according to ASTM D4287 using a Brookfield DVIII Coneand Plate Viscometer. Component (A) is typically present in the curablecomposition of the tie layer 30 in an amount of from 25 to 99.5 parts byweight, per 100 parts by weight of the curable composition of the tielayer 30.

In some embodiments, component (A) has a degree of polymerization (dp)of above 1500 and a Williams plasticity number, as determined using ASTMD926, of from 95 to 125. The plasticity number, as used herein, isdefined as a thickness in millimeters×100 of a cylindrical test specimen2 cm³ in volume and approximately 10 mm in height after the specimen hasbeen subjected to a compressive load of 49 Newtons for three minutes at25° C.

Referring now to component (B), this component typically includes asilicone resin (M, D, T, and/or Q) or mixture of resins. The resin(s)may or may not include functional groups that could react with component(A). Component (B) may be combined with component (A) with or withoutsolvent. More specifically, component (B) may include an organosiloxaneresin such as an MQ resin including R⁶ ₃SiO_(1/2) units and SiO_(4/2)units, a TD resin including R⁶SiO_(3/2) units and R⁶ ₂SiO_(2/2) units,an MT resin including R⁶ ₃SiO_(1/2) units and R⁶SiO_(3/2) units, an MTDresins including R⁶ ₃SiO_(1/2) units, R⁶SiO_(3/2) units, and R⁶₂SiO_(2/2) units, and combinations thereof. In these formulas, R⁶ is asdescribed above.

The symbols M, D, T, and Q used above represent the functionality ofstructural units of polyorganosiloxanes including organosilicon fluids,rubbers (elastomers) and resins. The symbols are used in accordance withestablished understanding in the art. Thus, M represents themonofunctional unit R⁶ ₃SiO_(1/2). D represents the difunctional unit R⁶₂SiO_(2/2). T represents the trifunctional unit R⁶SiO_(3/2). Qrepresents the tetrafunctional unit SiO_(4/2). Generic structuralformulas of these units are shown below:

Typically, the weight average molecular weight of component (B) is atleast 5,000 and typically greater than 10,000 g/mol. Component (B) istypically present in the curable composition of the tie layer 30 in anamount of from 0.5 to 75 parts by weight per 100 parts by weight per 100parts by weight of the curable composition of the tie layer 30.

Without intending to be bound by any particular theory, it is believedthat the aforementioned components (A) and (B) impart outstanding UVresistance to the tie layer 30. Use of these silicones may reduce oreliminate a need to include a UV additive or cerium doped glass in themodule 20. These silicones may also exhibit long term UV and visuallight transmission thereby maximizing an efficiency of the module 20.

Referring now to component (C), this component typically includes acuring catalyst. The catalyst may be of any type known in the art andtypically is selected from the group of condensation catalysts,hydrosilylation catalysts, radical catalysts, UV catalysts, thermalcatalysts, and combinations thereof. Choice of this catalyst may reduceproduction and processing times by >20% and may eliminate certainproduction steps altogether, thereby leading to decreased productioncosts and purchasing costs for the end user.

In one embodiment, component (C) is the same as the hydrosilylationcatalyst introduced above. In another embodiment, component (C) includesa peroxide catalyst which is used for free-radical based reactionsbetween siloxanes including, but not limited to, ═Si—CH₃ groups andother ═Si—CH₃ groups or ═Si—CH₃ groups and ═Si-alkenyl groups (typicallyvinyl), or ═Si-alkenyl groups and ═Si-alkenyl groups. Suitable peroxidecatalysts may include, but are not limited to, 2,4-dichlorobenzoylperoxide, benzoyl peroxide, dicumyl peroxide, tert-butyl perbenzoate.1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane (TMCH)(2,5-bis(t-butylperoxy)-2,5-dimethylhexane) catalyst1,1-bis(tert-amylperoxy)cyclohexane, ethyl3,3-bis(tert-amylperoxy)butyrate, 1,1-bis(tert-butylperoxy)cyclohexane,and combinations thereof. These catalysts may be utilized as a neatcompound or in an inert matrix (liquid or solid).

Typically, when one or more peroxide catalysts are used, a temperatureat which curing is initiated is generally determined/controlled on abasis of a half-life of the catalyst. However, a rate of cure andultimate physical properties of the curable compound and the tie layer30 are controlled by a level of unsaturation of compounds used to formthe tie layer 30. Additionally, reaction kinetics and physicalproperties can be tuned by blending linear non-reactively endblockedpolymers with differing degrees of polymerization (dp) withdimethylmethylvinyl-copolymers with or without vinyl endblocking.

In yet another embodiment, component (C) includes a condensationcatalyst and may also include a combination of the condensation catalystwith one or more silanes or siloxane based cross-linking agents whichinclude silicon bonded hydrolysable groups such as acyloxy groups (forexample, acetoxy, octanoyloxy, and benzoyloxy groups), ketoximino groups(for example dimethyl ketoxime and isobutylketoximino groups), alkoxygroups (for example methoxy, ethoxy, and propoxy groups), alkenyloxygroups (for example isopropenyloxy and 1-ethyl-2-methylvinyloxy groups),and combinations thereof. It is also contemplated that condensationcatalysts may be used in component (C) when the curable composition ofthe tie layer 30 includes resin polymer blends that are prepared suchthat they form a sheeting material that, on exposure to a moistatmosphere, reacts to form a permanent network. Alternatively,condensation catalysts may be used in component (C) when the curablecomposition of the tie layer 30 includes alkoxy-functional siliconepolymers that are capable of co-reacting with the moisture triggeredpolymers.

Component (C) may include any suitable condensation catalyst known inthe art. More specifically, the condensation catalyst may include, butis not limited to, tin, lead, antimony, iron, cadmium, barium,manganese, zinc, chromium, cobalt, nickel, aluminum, gallium, germanium,zirconium, and combinations thereof. Non-limiting particularly suitablecondensation catalysts include alkyltin ester compounds such asdibutyltin dioctoate, dibutyltin diacetate, dibutyltin dimaleate,dibutyltin dilaurate, butyltin 2-ethylhexoate, 2-ethylhexoates of iron,cobalt, manganese, lead and zinc, and combinations thereof.

Alternatively, the condensation catalyst may include titanates and/orzirconates having the general formula Ti[OR]₄ or Zr[OR]₄ respectively,wherein each R may be the same or different and represents a monovalent,primary, secondary or tertiary aliphatic hydrocarbon group which may belinear or branched and have from 1 to 10 carbon atoms. In oneembodiment, the condensation catalyst includes a titanate includingpartially unsaturated groups. In another embodiment, the condensationcatalyst includes titanates and/or zirconates wherein R includes methyl,ethyl, propyl, isopropyl, butyl, tertiary butyl, and/or branchedsecondary alkyl groups such as 2,4-dimethyl-3-pentyl, and combinationsthereof. Typically, when each R is the same, R is an isopropyl group,branched secondary alkyl group or a tertiary alkyl group, and, inparticular, a tertiary butyl group. Alternatively, the titanate may bechelated. Chelation may be accomplished with any suitable chelatingagent such as an alkyl acetylacetonate such as methyl orethylacetylacetonate. Examples of suitable titanium and/or zirconiumbased catalysts are described in EP 1254192 which is expresslyincorporated herein by reference relative to these catalysts. Typically,the condensation catalyst, if utilized, is present in an amount of from0.01 to 3% by weight of the total curable composition of the tie layer30.

Component (C) may alternatively include a cationic initiator which canbe used when the curable composition of the tie layer 30 includescycloaliphatic epoxy functionality. Typically, the cationic initiatorsare suitable for thermal and/or UV cure and may be used when the curablecomposition of the tie layer 30 includes iodonium or sulfonium saltsthat will produce a cured network upon heating. In one embodiment, thecationic initiator is used in combination with a radical initiator. Thiscombination can be cured by UV-visible irradiation when sensitized withsuitable UV-visible radical initiators such those described above.

Referring now to component (D), this component includes a cross-linkingagent which may have a linear, partially branched linear, cyclic, or anet-like structure. The cross-linking agent may be includedindependently of, or in combination with, the catalysts described above.The cross-linking agent may be any known in the art and typicallyincludes the organohydrogensilicon compound described above. Of course,it is to be understood that component (D) may be selected independentlyof the organohydrogensilicon compound.

In various embodiments, the cross-linking agent may have two buttypically has three or more silicon-bonded hydrolysable groups permolecule. If the cross-linking agent is a silane and has threesilicon-bonded hydrolysable groups per molecule, the cross-linking agentmay also include a non-hydrolysable silicon-bonded organic group. Thesesilicon-bonded organic groups are typically hydrocarbyl groups which areoptionally substituted by halogen such as fluorine and chlorine.Examples of suitable groups include, but are not limited to, alkylgroups such as methyl, ethyl, propyl, and butyl groups, cycloalkylgroups such as cyclopentyl and cyclohexyl groups, alkenyl groups such asvinyl and allyl groups, aryl groups such as phenyl and tolyl groups,aralkyl groups such as 2-phenylethyl groups, and halogenated derivativesthereof. Most typically, the non-hydrolysable silicon-bonded organicgroup is a methyl group.

In another embodiment, the cross-linking agent includes one or moresilanes including hydrolysable groups such as acyloxy groups (e.g.acetoxy, octanoyloxy, and benzoyloxy groups), ketoximino groups (e.g.dimethyl ketoximo and isobutylketoximino groups), alkoxy groups (e.g.methoxy, ethoxy, and propoxy groups), alkenyloxy groups (e.g.isopropenyloxy and 1-ethyl-2-methylvinyloxy groups), and combinationsthereof. These siloxanes may be straight chained, branched, or cyclic.

As described above, the cross-linking agent may be combined with theaforementioned catalyst of component (C). In one embodiment, thecross-linking agent includes oximosilanes and/or acetoxysilanes and iscombined with a tin catalyst such as diorganotin dicarboxylate,dibutyltin dilaurate, dibutyltin diacetate, dimethyltin bisneodecanoate,and combinations thereof. In another embodiment, the cross-linking agentincludes alkoxysilanes combined with titanate and/or zirconate catalystssuch as tetrabutyl titanate, tetraisopropyl titanate, chelated titanatesor zirconates such as diisopropyl bis(acetylacetonyl)titanate,diisopropyl bis(ethylacetoacetonyl)titanate, diisopropoxytitaniumbis(ethylacetoacetate), and combinations thereof. Alternatively, thecross-linking agent may include one or more silanes or siloxanes whichmay include silicon bonded hydrolysable groups such as acyloxy groups(for example, acetoxy, octanoyloxy, and benzoyloxy groups), ketoximinogroups (for example dimethyl ketoximo and isobutylketoximino groups),alkoxy groups (for example methoxy, ethoxy, and propoxy groups) andalkenyloxy groups (for example isopropenyloxy and1-ethyl-2-methylvinyloxy groups). In the case of siloxanes, themolecular structure can be straight chained, branched, or cyclic.

The curable composition of the tie layer 30 may also include component(E). This component typically includes a highly functional modifier.Suitable modifiers include, but are not limited to, methyl vinyl cyclicorganopolysiloxane structures (E^(Vi) _(x)) and branched structures suchas (M^(Vi)E_(x))₄Q structures, which are described in EP 1070734 whichis expressly incorporated herein by reference relative to thesestructures. If included, component (E) may be used in amounts determinedby those of skill in the art.

In addition to components (A-E), the curable composition of the tielayer 30 may further include a block copolymer and/or a mixture of ablock copolymer and a silicone resin. The block copolymer may be usedalone but is typically cured using one of the catalysts described above.The block copolymer may include a thermoplastic elastomer having a“hard” segment (i.e., having a glass transition point T_(g)≧ theoperating temperature of the module 20) and a “soft” segment (i.e.,having a glass transition point T_(g)≦ the operating temperature of themodule 20). Typically, the soft segment is an organopolysiloxanesegment. It is contemplated that the block copolymer may be an AB, anABA, or (AB)_(n) block copolymer.

More specifically, these block co-polymers may be prepared from a hardsegment polymer prepared from an organic monomer or oligomer orcombination of organic monomers and/or oligomers including, but notlimited to, styrene, methylmethacrylate, butylacrylate, acrylonitrile,alkenyl monomers, isocyanate monomers and combinations thereof.Typically, the hard segment polymer is combined or reacted with a softsegment polymer prepared from a compound having at least one siliconatom such as an organopolysiloxane polymer. Each of the aforementionedhard and soft segments can be linear or branched polymer networks orcombination thereof.

Preferred block-copolymers include silicone-urethane and silicone-ureacopolymers. Silicone-urethane and silicone-urea copolymers, described inU.S. Pat. Nos. 4,840,796 and 4,686,137, expressly incorporated herein byreference relative to these copolymers, have been known to formmaterials with good mechanical properties such as being elastomeric atroom temperature. Desired properties of these silicone-urea/urethanecopolymers can be optimized by varying a level of polydimethylsiloxane(PDMS), a type of chain extender used, and a type of isocyanate used. Ifincluded, the block copolymers are typically present in the curablecomposition of the tie layer 30 in an amount of from 1 to 100 parts byweight per 100 parts by weight of the curable composition of the tielayer 30.

The curable composition of the tie layer 30 may also include a curinginhibitor to improve handling conditions and storage properties. Thecuring inhibitor may be any known in the art and may include, but is notlimited to, methyl-vinyl cyclics, acetylene-type compounds, such as2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol,1-ethynyl-1-cyclohexanol, 1,5-hexadiene, 1,6-heptadiene,3,5-dimethyl-1-hexen-1-yne, 3-ethyl-3-buten-1-yne and/or3-phenyl-3-buten-1-yne, an alkenylsiloxane oligomer such as1,3-divinyltetramethyldisiloxane, 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane, or 1,3-divinyl-1,3-diphenyldimethyldisiloxane, asilicone compound including an ethynyl group such asmethyltris(3-methyl-1-butyn-3-oxy)silane, a nitrogen compound such astributylamine, tetramethylethylenediamine, benzotriazole, a phosphoruscompound such as triphenylphosphine, sulphur compounds, hydroperoxycompounds, maleic-acid derivatives thereof, and combinations thereof.Alternatively, the curing inhibitor may be selected from the curinginhibitors disclosed in U.S. Pat. Nos. 6,020,409 and 6,169,155,expressly incorporated herein by reference relative to the curinginhibitors. If included, the curing inhibitors are typically included inan amount of less than 3 parts by weight, more typically of from 0.001to 3 parts by weight, and most typically of from 0.01 to 1 part byweight, per 100 parts by weight of component (A).

Each of the components (A-E) may be pre-reacted (or tethered) together,also known in the art as bodying. In one embodiment, silanol functionalpolymers are tethered to silanol functional resins. This tetheringtypically involves condensation and re-organization and can be carriedout using base or acid catalysis. Tethering can be further refined bythe inclusion of reactive or non-reactive organo-silane species.

Still further, the curable composition of the tie layer 30 may includeadditives such as fillers, extending fillers, pigments, adhesionpromoters, corrosion inhibitors, dyes, diluents, anti-soiling additives,and combinations thereof, which may be the same or different than thosedescribed in detail above. The curable composition of the tie layer 30may be cured by any mechanism known in the art including, but notlimited to, those described in detail above.

In one embodiment, the tie layer 30 is substantially free of siliconebased resins. In another embodiment, the tie layer 30 is substantiallyfree of thermoplastic resins. The terminology “substantially free”represents an amount of the silicone based resins and/or thermoplasticresins in the tie layer 30 of less than 1,000, more typically of lessthan 500, and most typically of less than 100, parts by weight per onemillion parts by weight of the curable composition of the tie layer 30.In a further embodiment, the tie layer 30 does not have suitablephysical properties such that it could be classified as a hot meltcomposition, i.e., as an optionally curable thermoset product that isinherently high in strength and resistant to flow (i.e. high viscosity)at room temperature.

Referring back, the second (outermost) layer 26 typically has adielectric strength of from 400 to 800 volts per mil. In one embodiment,the second (outermost) layer 26 has a dielectric strength of from 400 to500 volts per mil. In another embodiment, the second (outermost) layer26 has a dielectric strength of from 500 to 600 volts per mil. In afurther embodiment, the second (outermost) layer 26 has a dielectricstrength of from 600 to 700 volts per mil. In yet another embodiment,the second (outermost) layer 26 has a dielectric strength of from 700 to800 volts per mil. The photovoltaic cell 24 and the second (outermost)layer 26 also typically have an adhesion strength of from 1 to 10 poundsper inch according to ASTM D903.

As described above, the module 20, by itself, includes the firstoutermost layer 22, the second (outermost) layer 26, and thephotovoltaic cell 24, one example of which is set forth in FIG. 1. Inone embodiment, the module 20 consists essentially of the firstoutermost layer 22, the photovoltaic cell 24, and the second (outermost)layer 26. In another embodiment the module 20 consists essentially ofthe first outermost layer 22, the photovoltaic cell 24, the second(outermost) layer 26, and the tie layer 30. In each of theseaforementioned embodiments, the module 20 does not include anyadditional tie layers, substrates, or photovoltaic cells. In a furtherembodiment, as shown in FIGS. 3 and 10, the module 20 includes the firstoutermost layer 22, the tie layer 30 disposed on, and in direct contactwith, the first outermost layer 22, the photovoltaic cell 24 disposedon, and spaced apart from, the first outermost layer 22, and the second(outermost) layer 26 disposed on, and in direct contact with, thephotovoltaic cell 24.

Alternatively, the module 20 may consist of the first outermost layer22, the photovoltaic cell 24, the second (outermost) layer 26, and theelectrical leads or consist of the first outermost layer 22, thephotovoltaic cell 24, the second (outermost) layer 26, the tie layer 30,and the electrical leads. It is also contemplated that the module 20 maybe free of or include polyethylene terephthalate, polyethylenenaphthalate, polyvinyl fluoride, and/or ethylene vinyl acetate. Themodule 20 may be totally free of all polymers except for siliconepolymers. Alternatively, the module 20 may be free of any layers thatinclude polyethylene terephthalate, polyethylene naphthalate, polyvinylfluoride, and/or ethylene vinyl acetate. In one embodiment, the module20 is free of Tedlar®.

Relative to the method of this invention, each of the first outermostlayer 22, the photovoltaic cell 24, the second (outermost) layer 26, thetie layer 30, and/or the supporting layer 28 may be present in themodule 20 in any order so long as the photovoltaic cell 24 is disposedon the first outermost layer 22 and the second (outermost) layer 26 isdisposed on the photovoltaic cell 24. In one embodiment, as specificallyrelated to the method of this invention, and as shown in FIGS. 2 and 9,the module 20 includes the first outermost layer 22, the photovoltaiccell 24 disposed on the first outermost layer 22, the second (outermost)layer 26 disposed on the photovoltaic cell 24, and the supporting layer28 disposed on the tie layer 26. In another embodiment, as specificallyrelated to the instant method, and as shown in FIGS. 4 and 11, themodule 20 includes the first outermost layer 22, the tie layer 30disposed on, and in direct contact with, the first outermost layer 22,the photovoltaic cell 24 disposed on, and spaced apart from, the firstoutermost layer 22, the second (outermost) layer 26 disposed on, and indirect contact with, the photovoltaic cell 24, and the supporting layer28 disposed on, and in direct contact with, the second layer 26.Additionally, the module 20 may include a protective seal (not shown inthe Figures) disposed along each edge of the module 20 to cover theedges. The module 20 may also be partially or totally enclosed within aperimeter frame that typically includes aluminum and/or plastic (alsonot shown in the Figures).

The instant invention also provides a photovoltaic array 32, as shown inFIG. 6A. The photovoltaic array 32 includes at least two modules 20.Typically the modules 20 are electrically connected, as described above,to provide suitable voltage. The photovoltaic array 32 may be of anysize and shape and may be utilized in any industry. More specifically,in FIG. 6A, the photovoltaic array 32 includes a series of modules 20 ofthe type shown in FIG. 1 that are electrically connected together.

The present invention also provides a method of forming the module 20.Relative to the method, the module 20 is not limited to the second layer26 being a second “outermost” layer. The module 20 of the method mayinclude the first outermost layer 22, the photovoltaic cell 24, and thesecond (outermost) layer 26. However, the module 20 of the method mayinclude the supporting layer 28 as the second outermost layer while thesecond layer 26 is an interior layer and not an outermost layer. Inaddition, the silicone composition used in the method is a liquidsilicone composition.

The method includes the steps of disposing the photovoltaic cell 24 onthe first outermost layer 22, disposing the liquid silicone compositionon the photovoltaic cell 24, and at least partially coating theplurality of fibers 27 with the liquid silicone composition to form thesecond (outermost) layer 26. The method also includes the step ofcompressing the first outermost layer 22, the photovoltaic cell 24, andthe second (outermost) layer 26 to form the module 20.

In one embodiment, the plurality of fibers 27 is at least partiallycoated prior to the step of disposing the liquid silicone composition onthe photovoltaic cell 24. In this embodiment, the plurality of fibers 27may be at least partially coated with the liquid silicone compositionseparately from the module 22, i.e., the second (outermost) layer 26 maybe a preformed sheet. In another embodiment, the plurality of fibers 27is at least partially coated after the step of disposing the liquidsilicone composition on the photovoltaic cell 24. That is, the liquidsilicone composition may be disposed on the photovoltaic cell 24 andthen the plurality of fibers 27 may be disposed (e.g. placed) in theliquid silicone composition to at least partially coat the fibers 27.Alternatively, the plurality of fibers 27 may be disposed on thephotovoltaic cell 24 and then the liquid silicone composition may beapplied to the plurality of fibers 27 on the photovoltaic cell 24.Further, the plurality of fibers 27 may be at least partially coatedsimultaneously with the step of disposing the liquid siliconecomposition on the photovoltaic cell 24. In other words, the pluralityof fibers 27 may be disposed on the photovoltaic cell 24 at the sametime and in the same space as the plurality of fibers 27 is disposed onthe photovoltaic cell 24.

The photovoltaic cell 24 can be disposed (e.g. applied) by any suitablemechanism known in the art but is typically disposed using an applicatorin a continuous mode. In one embodiment, the photovoltaic cell 24 isdisposed on the first outermost layer 22 via chemical vapor depositionor physical sputtering. Other suitable mechanisms of disposing thephotovoltaic cell 24 on the first outermost layer 22 include applying aforce to the photovoltaic cell 24 to more completely contact thephotovoltaic cell 24 and the first outermost layer 22.

Referring to the step of disposing the liquid silicone composition onthe photovoltaic cell 24, this step may also include any suitableapplication method known in the art including, but not limited to, spraycoating, flow coating, curtain coating, dip coating, extrusion coating,knife coating, screen coating, laminating, melting, pouring, brushing,and combinations thereof.

As first introduced above, the method also includes the step of at leastpartially coating the plurality of fibers 27 with the liquid siliconecomposition. The step of at least partially coating may be accomplishedby any means known in the art including, but not limited to, spraycoating, flow coating, curtain coating, dip coating, extrusion coating,knife coating, screen coating, laminating, melting, pouring, brushing,and combinations thereof. In one embodiment, the plurality of fibers 27is at least partially coated by placing the plurality of fibers 27 in anamount of the liquid silicone composition. In a further embodiment, theplurality of fibers 27 can be at least partially coated as part of themodule 20.

In another embodiment, the silicone composition is supplied to a user asa multi-part system including a first and a second part. The first andsecond parts may be mixed immediately prior to at least partiallycoating the plurality of fibers 27 and/or immediately prior to disposingthe liquid silicone composition on the photovoltaic cell 24. In afurther embodiment, the method further includes the step of partiallycuring, e.g. “pre-curing,” the liquid silicone composition and/orcurable composition to form the second (outermost) layer 26 and/or thetie layer 30, respectively. Additionally, the method may include thestep of curing the liquid silicone composition and/or the curablecomposition to form the second (outermost) layer 26 and/or the tie layer30, respectively. Additionally, the step of at least partially coatingthe plurality of fibers 27 may be further defined as encapsulating allor a part of the plurality of fibers 27. In one embodiment, the step ofat least partially coating the plurality of fibers 27 may be furtherdefined as encapsulating at least part of the photovoltaic cell 24.

In an additional embodiment, the method may include the step of treatingthe first outermost layer 22, the photovoltaic cell 24, the tie layer26, the supporting layer 28, and/or the tie layer 30, with a plasma, asdescribed in U.S. Pat. No. 6,793,759, incorporated herein by reference.

Referring now to the step of compressing, it is to be understood thateven after the step of compressing, the photovoltaic cell 24 and thefirst outermost layer 22 do not need to be in direct contact. The stepof compressing may be further defined as applying a vacuum to thephotovoltaic cell 24 and the first outermost layer 22. Alternatively, amechanical weight, press, or roller (e.g. a pinch roller) may be usedfor compression. The plurality of fibers 27 extending laterally acrossthe second (outermost) layer 26 to the periphery 36 of the module 20resists leakage of the liquid silicone composition from the module 20during the step of compressing.

Further, the step of compressing may be further defined as laminating.Still further, the method may include the step of applying heat to themodule 20. Heat may be applied in combination with any other step or maybe applied in a discrete step. The entire method may be continuous orbatch-wise or may include a combination of continuous and batch-wisesteps.

EXAMPLES Formation of Modules:

Two modules (Modules A and B) are formed according to the method ofinstant invention. In addition, four comparative modules (ComparativeModules A-D) are also formed but not according to the method of theinstant invention. In the Modules A and B, a plurality of fibers extendslaterally across a second layer to a periphery of the Modules on bothends of the Modules.

More specifically, Module A includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm photovoltaic cell disposed on the first outermostlayer;

A 5-mil second layer uniformly disposed on and across the photovoltaiccell and including a textile (non-woven fiberglass) as the plurality offibers that is at least partially coated with a first liquid siliconecomposition; and

A 156 mm×156 mm×125 μm supporting layer (Tedlar®) disposed on the secondlayer.

Module B includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm contact photovoltaic cell disposed on the firstoutermost layer; and

A 15-mil second layer uniformly disposed on and across the photovoltaiccell and including a textile (non-woven polyester) as the plurality offibers that is at least partially coated with a second liquid siliconecomposition. Module B does not include a supporting layer.

Comparative Module A includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm photovoltaic cell disposed on the first outermostlayer;

A 15-mil second layer uniformly disposed on and across the photovoltaiccell and including the liquid silicone composition of Module 1; and

A 156 mm×156 mm×125 μm supporting layer (Tedlar®) disposed on the tielayer. Comparative Module A does not include a plurality of fibers.

Comparative Module B includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm photovoltaic cell disposed on the first outermostlayer; and

A 15-mil second layer uniformly disposed on and across the photovoltaiccell and including the liquid silicone composition of Module B.Comparative Module B does not include a plurality of fibers or asupporting layer.

Comparative Module C includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm contact photovoltaic cell disposed on the firstoutermost layer;

A 15-mil second layer uniformly disposed on and across the photovoltaiccell and including a textile (non-woven fiberglass) as the plurality offibers that is at least partially coated with ethylene vinyl acetatepolymer; and

A 156 mm×156 mm×125 μm supporting layer (Tedlar®) disposed on the tielayer. Comparative Module C does not include silicone.

Comparative Module D includes:

A 156 mm×156 mm×3.2 mm first outermost layer (glass) having a lighttransmittance of at least 70 percent as determined by UV/Visspectrophotometry using ASTM E424-71;

A 156 mm×156 mm×200 μm photovoltaic cell disposed on the first outermostlayer; and

A 15-mil second layer uniformly disposed on and across the photovoltaiccell and including a textile (non-woven polyester) as the plurality offibers that is at least partially coated with an ethylene vinyl acetatepolymer. Comparative Module D does not include silicone or a supportinglayer.

The glass is commercially available from AFG Industries, Inc. under thetrade name Solatex® 2000. The non-woven fiberglass is commerciallyavailable from Crane Nonwovens of Dalton, Mass. The non-woven polyesteris also commercially available from Crane Nonwovens of Dalton, Mass. Thephotovoltaic cells are commercially available from Trina Solar and BPSolar. The Tedlar® is commercially available from DuPont. The ethylenevinyl acetate polymer is also commercially available from DuPont. Thefirst and second liquid silicone compositions are set forth in Table 1below wherein all parts are in parts by weight, unless otherwiseindicated. After formation, the Modules 1 and 2 and the ComparativeModules 1-4 are visually evaluated to determine a presence of VoidSpaces in the second layer. The results of these evaluations are alsoset forth in Table 1 below.

TABLE 1 Comp. Comp. Comp. Comp. Mod. Mod. Mod. Mod. Mod. Mod.Formulation A B A B C D First/Second Yes Yes Yes Yes — — SiliconeCompositions Polymer 1 88.31 47.10 88.31 47.10 — — Polymer 2 8.96 4.618.96 4.61 — — Polymer 3 0.60 0.74 0.60 0.74 — — Adhesion 1.01 0.98 1.010.98 — — Promoter 1 Adhesion 1.01 0.98 1.01 0.98 — — Promoter 2 Catalyst0.06 0.25 0.06 0.25 — — Cure Inhibitor 0.06 0.01 0.06 0.01 — — Filler —45.33 — 45.33 — — Total ~100 ~100 ~100 ~100 — — SiH:SiVi 0.95 1.05 0.951.05 — — Ratio Weight Ratio 15.00 6.27 15.00 6.27 — — of Polymer 2:Polymer 3 Amount of 5.05 12.76 5.05 12.76 — — Platinum from Catalyst(ppm) Ethylene — — — — Yes Yes Vinyl Acetate (EVA) Polymer Non-Woven Yes— — — Yes — Fiberglass Non-Woven — Yes — — — Yes Polyester Tedlar ® Yes— Yes — Yes — Thickness of 5 15 15 15 9 15 Silicone/EVA (mils) VoidSpaces No No No Yes No No

Polymer 1 is a vinyldimethylsilyl end-blocked polydimethylsiloxanehaving a viscosity of 450 mPa·s at 25° C. and including 0.46 weightpercent Si-Vinyl bonds.

Polymer 2 is a dimethylhydrogensilyl terminated polydimethylsiloxanethat has a viscosity of 10 mPa·s and 0.16 weight percent of Si—H bonds.

Polymer 3 is a trimethylsilyl terminatedpolydimethylsiloxane-methylhydrogensiloxane co-polymer having aviscosity of 5 mPa·s and including 0.76 weight percent of Si—H bonds.

Adhesion Promoter 1 is a reaction product of trimethylsilyl- anddimethylvinylsilyl-treated silica and an organofunctional silane and hasa viscosity of 25 mPa·s.

Adhesion Promoter 2 is a reaction product of trimethylsilyl- anddimethylvinylsilyl-treated silica and an epoxy functional silane and hasa viscosity of 25 mPa·s.

Catalyst is a platinum catalyst including platinum complexes of1,3-diethenyl-1,1,3,3-tetramethyldisiloxane.

Cure Inhibitor is methylvinylcyclosiloxane having a viscosity of 3mPa·s. with an average DP of 4, an average weight average molecularweight of 344 g/mol, and 31.4 weight percent of Si-Vinyl bonds.

Filler is a quartz filler having an average particle size of 5 μm.

As set forth in Table 1 above, Modules A and B of the instant inventioncan be formed with less material, i.e., less silicone, as demonstratedthrough the decreased thickness of the silicone in the tie layer ofModule A. This reduces production times, costs, and complexities. TheModules A and B also do not include Void Spaces. This increasesstructural strength and stability of the Modules. As described above,the Modules A and B are formed by the method of this invention whereinthe plurality of fibers extends laterally across the second layer to aperiphery of the Modules on both ends of the Modules to resist leakageof the liquid silicone composition from the Modules during the step ofcompressing.

Formation of Additional Layers:

Additional layers (Layers A-E) are also formed and are evaluated todetermine Dielectric Strength (volts/mil) and Corrected DielectricStrength (volts/mil). The Layers A-E are formed and evaluated apart fromany first outermost layer and any photovoltaic cells. Layer A includesonly ethylene vinyl acetate, does not include a plurality of fibers, anddoes not represent a tie layer of the instant invention. Layer Bincludes only a silicone composition, does not include a plurality offibers, and does not represent the second (outermost) layer of theinstant invention. Layer C represents one possible second (outermost)layer of the instant invention, includes the silicone composition ofLayer B, and includes a plurality of polyester fibers at least partiallycoated with the silicone composition. More specifically, Layer Cincludes a layer of non-woven polyester fibers that is 4 mils thick.Layer D represents another possible second (outermost) layer of theinstant invention, includes the silicone composition of Layer B, andincludes a plurality of fiberglass fibers at least partially coated withthe silicone composition. More specifically, Layer D includes a layer ofnon-woven fiberglass fibers that is 4 mils thick. Layer E represents yetanother possible second (outermost) layer of the instant invention,includes the silicone composition of Layer B, and includes a pluralityof fiberglass fibers at least partially coated with the siliconecomposition. More specifically, Layer E includes two layers of non-wovenfiberglass fibers that are 4 and 5 mils thick, respectively. The LayersA-E and the results of the evaluations of Dielectric Strength andCorrected Dielectric Strength are set forth in Table 2 below.

TABLE 2 Layer A Layer B Layer C Layer D Layer E Silicone No Yes Yes YesYes Composition Polymer 1 — 90.81 90.81 90.81 90.81 Polymer 2 — 8.5 8.58.5 8.5 Polymer 3 — 0.57 0.57 0.57 0.57 Catalyst — 0.06 0.06 0.06 0.06Cure Inhibitor — 0.06 0.06 0.06 0.06 Total — 100 100 100 100 SiH:SiViRatio — 1.1 1.1 1.1 1.1 Pt Content — 4.9 4.9 4.9 4.9 (ppm) EthyleneVinyl Yes No No No No Acetate (EVA) Polymer Non-Woven No No No Yes YesFiberglass (2 Layers; (4 mils) 4 + 5 mil) Non-Woven No No Yes No NoPolyester (4 mils) Thickness of 17 21 19 19 20 Silicone + (Non-Woven orEVA) (mils) Dielectric 907 720 752 737 790 Strength (Volts/mil)Corrected 907 795 No Data No Data No Data Dielectric Strength (17 mil)(Volts/mil)

In Table 2, the Polymers 1-3, the Catalyst, and the Cure Inhibitor arethe same as those set forth in Table 1. The data set forth abovesuggests that the Layers of this invention perform as well or betterthan comparative layers that are not of this invention. The data alsosuggests that the plurality of fibers and the silicone composition ofthis invention allow for cost effective and repeatable production ofphotovoltaic cell modules because of controlled diffusion of thesilicone composition, minimization of the amount of silicone compositionused through resistance to leakage of the silicone composition from theModules during the step of compressing, minimized waste, and increasedconsistency of thickness and size of the module. The plurality of fibersand the silicone composition also allow for formation of a modulewithout a supporting layer thereby reducing costs, productioncomplexities, and time needed to form the module.

Formation of Hydrosilylation-Curable Silicone Compositions:

A series of hydrosilylation-curable silicone compositions (Compositions1-10) are also formed according to this invention, as set forth in Table3 below. After formation, the Compositions 1-10 are heated at about 125°C. for a time of from 15 to 20 minutes to cure and to form three groupsof corresponding layers (Layers 1-10) that represent various embodimentsof the second (outermost) layer of this invention. The Layers 1-10 areevaluated for various physical properties, as further described below.

TABLE 3 Compo- Compo- Compo- sition 1 sition 2 sition 3 Composition 4Branched Organosilicon — — — 3.93 Compound Linear 90.8 35.1 43.15 —Organosilicon Compound 1 Linear — — — 92.35 Organosilicon Compound 2Linear — — 5.68 — Organosilicon Compound 3 Organohydrogensilicon 8.5 —4.9 — Compound 1 (chain-extender) Organohydrogensilicon 0.57 1.44 0.613.62 Compound 2 (cross-linker) Inhibitor 0.07 0.19 0.025 0.03 Catalyst 1— 0.09 — — Catalyst 2 0.06 — 0.065 0.07 Filler — 55.38 44.55 — Pigment —7.57 — — Adhesion Promoter 1 — — 1.01 — Adhesion Promoter 2 — 0.226 — —Total Wt % 100.00 100.00 99.99 100.00 SiH/SiVi Ratio 1.1 1.12 1.04 1.49Ratio of Chain-Extender to 15 N/A 8 N/A Cross-Linker Pt Concentration(ppm) 4.9 5.4 5.7 6.0 Compo- Compo- Compo- sition 5 sition 6 sition 7Composition 8 Branched Organosilicon 6.74 9.33 13.19 9.29 CompoundLinear — — — — Organosilicon Compound 1 Linear 88.01 84.03 78.18 74.09Organosilicon Compound 2 Linear — — — 10.01 Organosilicon Compound 3Organohydrogensilicon — — — — Compound 1 (chain-extender)Organohydrogensilicon 5.16 6.54 8.53 6.51 Compound 2 (cross-linker)Inhibitor 0.03 0.04 0.03 0.03 Catalyst 1 — — — — Catalyst 2 0.07 0.070.07 0.07 Filler — — — — Pigment — — — — Adhesion Promoter 1 — — — —Adhesion Promoter 2 — — — — Total Wt % 100.01 100.01 100.00 100.00SiH/SiVi Ratio 1.51 1.51 1.50 1.53 Ratio of Chain-Extender to N/A N/AN/A N/A Cross-Linker Pt Concentration (ppm) 6.0 5.8 6.0 5.7 Composition9 Composition 10 Branched Organosilicon 4.68 4.67 Compound Linear — —Organosilicon Compound 1 Linear 42.11 37.22 Organosilicon Compound 2Linear — 5.03 Organosilicon Compound 3 Organohydrogensilicon — —Compound 1 (chain-extender) Organohydrogensilicon 3.32 3.32 Compound 2(cross-linker) Inhibitor 0.01 0.03 Catalyst 1 — — Catalyst 2 0.07 0.06Filler 49.81 49.67 Pigment — — Adhesion Promoter 1 — — Adhesion Promoter2 — — Total Wt % 100.00 100.00 SiH/SiVi Ratio 1.54 1.54 Ratio ofChain-Extender to N/A N/A Cross-Linker Pt Concentration (ppm) 5.72 5.72

Branched Organosilicon Compound is a polydimethylsiloxane that includestwo terminal unsaturated (i.e., vinyl) moieties per molecule and atleast one pendant unsaturated (i.e., vinyl) moiety per molecule, has aaverage degree of polymerization of about 620, a weight averagemolecular weight of about 46,000 g/mol, a viscosity of about 15,000 cpsat 25° C. determined according to ASTM D4287, and a weight percent ofvinyl groups of about 7.7%.

Linear Organosilicon Compound 1 is a polydimethylsiloxane that includestwo terminal unsaturated (i.e., vinyl) moieties per molecule, has aaverage degree of polymerization of about 297, a weight averagemolecular weight of about 22,000 g/mol, a viscosity of about 2,100 cpsat 25° C. determined according to ASTM D4287, and a weight percent ofvinyl groups of about 0.21%.

Linear Organosilicon Compound 2 is a polydimethylsiloxane that includestwo terminal unsaturated (i.e., vinyl) moieties per molecule, has aaverage degree of polymerization of about 155, a weight averagemolecular weight of about 11,500 g/mol, a viscosity of about 450 cps at25° C. determined according to ASTM D4287, and a weight percent of vinylgroups of about 0.46%.

Linear Organosilicon Compound 3 is a polydimethylsiloxane that includestwo terminal unsaturated (i.e., vinyl) moieties per molecule, has aaverage degree of polymerization of about 837, a weight averagemolecular weight of about 62,000 g/mol, a viscosity of about 55,000 cpsat 25° C. determined according to ASTM D4287, and a weight percent ofvinyl groups of about 0.088%.

Organohydrogensilicon Compound 1 is a dimethylhydrogen terminateddimethyl siloxane chain extender, has a average degree of polymerizationof about 12, a weight average molecular weight of about 894 g/mol, aviscosity of about 10 centistokes at 25° C. determined according to ASTMD4287, and a weight percent of Si—H groups of about 0.16%.

Organohydrogensilicon Compound 2 is a cross-linker that is a dimethyl,methylhydrogen siloxane that is trimethylsiloxy terminated. Thiscross-linker has a average degree of polymerization of about 10, aweight average molecular weight of about 684 g/mol, a viscosity of about5 centistokes at 25° C. determined according to ASTM D4287, and a weightpercent of Si—H groups of about 0.76%.

Inhibitor is methylvinylcyclosiloxane having a average degree ofpolymerization of about 4, a weight average molecular weight of about344 g/mol, a viscosity of about 3 cps at 25° C. determined according toASTM D4287, and a weight percent of vinyl groups of about 31.4%.

Catalyst 1 is a 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complex withplatinum in a silicone fluid that has a weight percent of vinyl groupsof about 1.97%.

Catalyst 2 is a 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complex withplatinum in a silicone fluid that has a weight percent of vinyl groupsof about 0.86%.

Filler is a quartz filler having an average particle size of 5 μm, amedian particle size is 1.8 μm, and greater than 97% of the filler hasan average particle size of 5 μm.

Pigment includes acetylene black, ZnO, and a silicone fluid

Adhesion Promoter 1 is methacryloxypropyltrimethoxysilane.

Adhesion Promoter 2 is a reaction product of trimethylsilyl anddimethylvinylsilyl treated silica and an epoxy functional silane and hasa viscosity of 25 mPa·s. determined according to ASTM D4287.

Formation of Layers from the Hydrosilylation-Curable SiliconeCompositions:

Referring back to the Layers 1-10 first introduced above, the Layers1-10 are formed in three groups. In a first group, Layers 1-10 areformed without any plurality of fibers. In a second group, Layers 1-10are formed and at least partially coat a 15 mil thick sheet of non-wovenfiberglass fibers. In a third group, Layers 1-10 are formed and at leastpartially coat a 15 mil thick sheet of non-woven polyester fibers. Afterformation, various samples of the Layers 1-10 from each of the threegroups are evaluated to determine Viscosity, Hardness, Tensile Strength,Elongation, Cut Strength, Dielectric Strength, Breakdown Voltage, andVolume Resistivity. The results of the evaluations are set forth belowin Table 4.

TABLE 4 Layer 1 Layer 2 Layer 3 Layer 4 Mix Viscosity (cps) 343 37505200 1566 Shore 00 Hardness 35 75 73 — Shore A Hardness — — — 21 TensileStrength (lb/in²) Not Tested Not Tested 296 154 % Elongation Not TestedNot Tested 166 161 Cut Strength - Fail Fail Fail Fail Without Pluralityof Fibers Cut Strength - Pass*⁺ Pass⁺ Pass⁺ Fail Including 15 milFiberglass Cut Strength - Not Tested Pass⁺ Pass⁺ Pass⁺ Including 15 milPolyester Dielectric Strength (volts/mil) Without Plurality of Fibers720 Not Tested Not Tested Not Tested Thickness of Layer (mils) 21 NotTested Not Tested Not Tested Dielectric Strength (volts/mil) Including 9mil Fiberglass 790 Not Tested Not Tested Not Tested Thickness of Layer(mils) 20 Not Tested Not Tested Not Tested Breakdown Voltage (kV)Without Plurality of Fibers 15.1 at 21 Not Tested Not Tested Not Testedmils Including 15 mil Fiberglass 15.8 at 20 Not Tested Not Tested NotTested mils Volume Resistivity (ohm-cm) Without Plurality of Fibers NotTested Not Tested Not Tested Not Tested Including 15 mil Fiberglass NotTested Not Tested Not Tested Not Tested Layer 5 Layer 6 Layer 7 Layer 8Mix Viscosity (cps) 1801 1768 1706 3006 Shore 00 Hardness — — — — ShoreA Hardness 23 27 32 28 Tensile Strength (lb/in²) 282 345 426 459 %Elongation 181 155 118 203 Cut Strength - Fail Fail Fail Fail WithoutPlurality of Fibers Cut Strength - Pass⁺ Pass⁺ Pass⁺⁺ Pass⁺⁺ Including15 mil Fiberglass Cut Strength - Pass⁺ Pass⁺ Pass⁺⁺ Pass⁺ Including 15mil Polyester Dielectric Strength (volts/mil) Without Plurality ofFibers Not Tested 705 Not Tested Not Tested Thickness of Layer (mils)Not Tested 23 Not Tested Not Tested Dielectric Strength (volts/mil)Including 15 mil Fiberglass Not Tested 643 Not Tested 802 Thickness ofLayer (mils) Not Tested 24 Not Tested 18 Breakdown Voltage (kV) WithoutPlurality of Fibers Not Tested 16.2 at 23 Not Tested Not Tested milsIncluding 15 mil Fiberglass Not Tested 15.4 at 24 Not Tested 14.4 at 18mils mils Volume Resistivity (ohm-cm) Without Plurality of Fibers NotTested 1.23E+15 Not Tested 1.38E+15 Including 15 mil Fiberglass NotTested 1.50E+14 Not Tested 3.94E+14 Layer 9 Layer 10 Mix Viscosity (cps)9700 13,400 Shore 00 Hardness — — Shore A Hardness 70 66 TensileStrength (lb/in²) 733 708 % Elongation 72 110 Cut Strength - Pass PassWithout Plurality of Fibers Cut Strength - Pass⁺⁺⁺ Pass⁺⁺⁺ Including 15mil Fiberglass Cut Strength - Pass⁺⁺⁺ Pass⁺⁺⁺ Including 15 mil PolyesterDielectric Strength (volts/mil) Without Plurality of Fibers 781 853Thickness of Layer (mils) 25 20 Dielectric Strength (volts/mil)Including 15 mil Fiberglass 753 855 Thickness of Layer (mils) 28 24Breakdown Voltage (kV) Without Plurality of Fibers 19.7 at 25 17.4 at 20mils mils Including 15 mil Fiberglass 21 at 28 mils 21 at 24 mils VolumeResistivity (ohm-cm) Without Plurality of Fibers 1.82E+15 2.81E+15Including 15 mil Fiberglass 2.45E+15 1.81E+15 *Indicates passage when 7mil Tedlar backsheet applied to Layer 1 ⁺represents a qualitative visualevaluation of the Layers that indicates that no holes or perforationsare present after the Cut-Test. ⁺⁺represents a qualitative visualevaluation of the Layers that is superior to the (+) above and indicatesthat there are no visual protruding marks present on a reverse side ofthe Layers from a side exposed to the Cut-Test. ⁺⁺⁺represents aqualitative visual evaluation of the Layers that is superior to the (+)and (++) above and indicates that there is very little visibility of anymarks present on the side of the Layers exposed to the Cut-Test.

Mix Viscosity is determined at 25° C. determined according to ASTMD4287.

Shore 00 Hardness is determined using ASTM D 2240.

Shore A Hardness is determined using ASTM D 2240.

Tensile Strength (lb/in²) is determined using ASTM D-412

% Elongation is determined using ASTM D-412.

Cut Strength is determined using a Cut-Test. The Cut-Test is performedusing UL-1703 and IEC 61730-2. A determination of “pass” is made basedon visual evaluation of no holes or perforations in the Layers inaddition to passage of a Wet-Leakage test described in greater detailbelow. Similarly, a determination of “fail” is made based on visualevaluation of one or more holes or perforations in the Layers and/orfailure of the Wet-Leakage test.

Dielectric Strength (volts/mil) is determined using ASTM D 149

Breakdown Voltage (kV) (also known in the art as “Breakthrough Voltage”)is calculated as Dielectric Strength (volts/mil)×sample thickness(mils).

Volume Resistivity (ohm-cm) is determined using ASTM D 257

The data set forth above suggest that the hydrosilylation-curablesilicone compositions of the instant invention can generally be used toeffectively form modules without Tedlar back sheets thus reducing costs,production complexities, and time needed to form photovoltaic modules.The data also suggests that use of a balance of linear organosiliconcompounds and branched organosilicon compounds can also strengthenmodules and can reduce a need to utilize expensive fillers and fibers.Moreover, the data suggests that use of the linear and branchedorganosilicon compounds along with fillers and/or fibers can provideadditional strength for modules for use in specialized applications.

Formation of Modules:

The Compositions 1, 3, 6, 8, and 10 are also utilized to form a seriesof modules (Modules 1, 3, 6, 8, and 10). The Modules 1, 3, 6, 8, and 10are each formed, top to bottom, as follows in Table 5:

TABLE 5 Structure of Modules 1, 3, 6, 8, 10 Identity Dimensions FirstOutermost Layer (22) Glass having a light transmittance of 204 mm × 204mm × at least 70 percent as determined by 125 mils UV/Visspectrophotometry using ASTM E424-71 Tie Layer (30) *Silicone 204 mm ×204 mm × 15 mils Photovoltaic Cell (24) Multicrystalline Cellcommercially 156 mm × 156 mm × available from Aleo Solar AG 200 μmSecond Outermost Layer (26) Compositions 1, 3, 6, 8, or 10 + 204 mm ×204 mm × 15 mil non-woven fiberglass sheet 20 mils Backsheet - Module 1only Tedlar ® 204 mm × 204 mm × 7 mils *Silicone is further defined as a“front side” encapsulant and includes 52.77 parts by weight of LinearOrganosilicon Compound 2, 10.75 parts by weight of Linear OrganosiliconCompound 3, 32.39 grams of a trimethylsiloxy terminated dimethylsiloxane having a viscosity of about 100 centistokes at 25° C.determined according to ASTM D4287, 3.77 parts by weight ofOrganohydrogensilicon Compound 1, 0.24 parts by weight ofOrganohydrogensilicon Compound 2, 0.01 parts by weight of the Inhibitor,and 0.07 parts by weight of Catalyst 2. The front side encapsulant alsohas a mixed initial viscosity of about 668 cps at 25° C. determinedaccording to ASTM D4287.

A Comparative Module is also formed, top to bottom, as follows in Table6:

TABLE 6 Structure of Comparative Module Identity Dimensions FirstOutermost Layer (22) Glass having a light transmittance of 204 mm × 204mm × at least 70 percent as determined by 125 mils UV/Visspectrophotometry using ASTM E424-71 Ethylene Vinyl Acetate — 204 mm ×204 mm × Polymer 17 mils Photovoltaic Cell (24) Multicrystalline Cellcommercially 156 mm × 156 mm × available from Aleo Solar AG 200 μmEthylene Vinyl Acetate — 204 mm × 204 mm × Polymer 17 mils Tedlar ® —204 mm × 204 mm × 7 mils

The glass of the Modules 1, 3, 6, 8, and 10 and the Comparative Moduleis commercially available from AFG Industries, Inc. under the trade nameSolatex® 2000. The fiberglass of the Modules 1, 3, 6, 8, and 10 iscommercially available from Crane Nonwovens of Dalton, Mass. Thephotovoltaic cells of the Modules 1, 3, 6, 8, and 10 and the ComparativeModule are commercially available from Trina Solar and BP Solar. TheTedlar® of the Module 1 and the Comparative Module is commerciallyavailable from DuPont. The ethylene vinyl acetate polymer of theComparative Module is also commercially available from DuPont.

Damp-Heat Resistivity Testing of Modules:

After formation, samples of each of the Modules 1, 3, 6, 8, and 10 andthe Comparative Module are evaluated per IEC 61215 Section 10.13, 1000Hr Damp Heat Test, to determine an effect of damp heat on resistivity(MOhm) after exposure to an environment at approximately 85° C. and 85%relative humidity (85/85) for varying periods of time. Once completed, aWet-Leakage test is performed according to IEC 61215 Section 10.15. Morespecifically, samples of each of the Modules 1, 3, 6, 8, and 10 and theComparative Module are exposed to the 85/85 environment both before andafter being subjected to the Cut-Test, as described above. Subsequently,the samples are then evaluated to determine resistivity.

A first set of each of the Modules 1, 3, 6, 8, and 10 and theComparative Module are placed in the 85/85 environment for approximately1152 hours, then subsequently subjected to the Cut-Test. After theCut-Test, the first set of Modules is submerged in 22.8° C. water for 2minutes and evaluated to determine resistivity per the Wet-Leakage test,as set forth below in Table 7.

After the 2 minutes of submersion, the same first set of Modules remainssubmerged for an additional 2 minutes (total of 4 minutes submersion).After 4 total minutes of submersion, the first set of Modules is againevaluated to determine resistivity, also set forth below in Table 7.

In each of the following tests, summarized in Tables 7-10 below, theModules 1, 3, 6, 8, and 10 and the Comparative Module are deemed to“pass” if the average resistivity is greater than 400 MOhms after beingsubmerged for varying times and undergoing the Cut-Test. In other words,if the Average of 2 and 4 Minute Data is greater than 400 MOhms, theModules “pass.” If less than 400 MOhms, the Modules “fail.”

TABLE 7 Average of 2 and MOhm MOhm 4 Minute 2 Min 4 Min Data First SetFirst Set First Set (1152 hr) (1152 hr) (1152 hr) Pass/Fail First SetModule 1 1000 1000 1000 Pass First Set Module 3 1000 1000 1000 PassFirst Set Module 6 1000 782 891 Pass First Set Module 8 1000 871 935Pass First Set Module 10 1000 1000 1000 Pass First Set 1000 1000 1000Pass Comparative Module

Additionally, after the submersion for 2 and 4 minutes described above,the first set of Modules is placed back in the 85/85 environment for anadditional time of about 1635 hours such that the total time of exposurefor the first set of Modules is approximately 2787 hours. After exposureto the 85/85 environment, the first set of Modules is submerged in 22.8°C. water for 2 minutes and evaluated to determine resistivity, as setforth below in Table 8.

After the 2 minutes of submersion, the same first set of Modules (afterexposure to the 85/85 environment for a total of approximately 2787hours) remains submerged for an additional 2 minutes (total of 4 minutessubmersion). After 4 total minutes of submersion, the first set ofModules is again evaluated to determine resistivity, also set forthbelow in Table 8.

TABLE 8 Average of 2 and MOhm MOhm 4 Minute 2 Min 4 Min Data First SetFirst Set First Set Pass/ (2787 hr) (2787 hr) (2787 hr) Fail First SetModule 1 73 63   68* Fail** First Set Module 3 1000 1000 1000 Pass FirstSet Module 6 767 502  634 Pass First Set Module 8 936 463  699 PassFirst Set Module 10 1000 1000 1000 Pass First Set 1000 1000 1000 PassComparative Module *Indicates that the First Set of Module 1 tested at2,376 hours of exposure to the 85/85 environment failed since ameasurement of greater than 400 MOhms is required to pass. **Indicatesthat at 1,968 hours, the sample passes with 831 MOhm average.

A second set of each of the Modules 1, 3, 6, 8, and 10 and theComparative Module are also prepared and then subsequently subjected tothe Cut-Test. After the Cut-Test, the second set of Modules is placed inthe 85/85 environment for approximately 1152 hours. Subsequently, thesecond set of Modules is submerged in 22.8° C. water for 2 minutes andevaluated to determine resistivity, as set forth below in Table 9.

After the 2 minutes of submersion, the same second set of Modulesremains submerged for an additional 2 minutes (total of 4 minutessubmersion). After 4 total minutes of submersion, the second set ofModules is again evaluated to determine resistivity, also set forthbelow in Table 9.

TABLE 9 Average MOhm of 2 and 2 Min MOhm 4 Minute Second 4 Min Data SetSecond Set Second Set Pass/ (1152 hr) (1152 hr) (1152 hr) Fail SecondSet Module 1 991 968 980 Pass Second Module 3 1000 1000 1000 Pass SecondModule 6 470 378 424 Pass Second Module 8 1000 609 804 Pass SecondModule 10 1000 1000 1000 Pass Second Comparative 1000 1000 1000 PassModule

Additionally, after the submersion for 2 and 4 minutes described above,the second set of Modules is placed back in the 85/85 environment for anadditional time of about 1536 hours such that the total time of exposurefor the first set of Modules is approximately 2688 hours. After exposureto the 85/85 environment, the second set of Modules is submerged in22.8° C. water for 2 minutes and evaluated to determine resistivity, asset forth below in Table 10.

After the 2 minutes of submersion, the same second set of Modules (afterexposure to the 85/85 environment for a total of approximately 2688hours) remains submerged for an additional 2 minutes (total of 4 minutessubmersion). After 4 total minutes of submersion, the second set ofModules is again evaluated to determine resistivity, also set forthbelow in Table 10.

TABLE 10 Average MOhm of 2 and 2 Min MOhm 4 Minute Second 4 Min Data SetSecond Set Second Set Pass/ (2688 hr) (2688 hr) (2688 hr) Fail SecondSet Module 1 35 30  32* Fail** Second Module 3 1000 1000 1000  PassSecond Module 6 726 370 548 Pass Second Module 8 586 426 506 Pass SecondModule 10 1000 1000 1000  Pass Second Comparative 945 1000 973 PassModule *Indicates that the Second Set of Module 1 tested at 2,376 hoursof exposure to the 85/85 environment failed since a measurement ofgreater than 400 MOhms is required to pass. **Indicates that at 1,968hours, the sample passes with 649 MOhm average.

The data set forth above suggests that the Modules 1, 3, 6, 8, and 10 ofthis invention generally perform as well as the Comparative Module whichis not of this invention. Accordingly, since the Modules 3, 6, 8, and 10can be formed without Tedlar, this invention reduces costs, productioncomplexities, and time needed to form photovoltaic modules.

The invention has been described in an illustrative manner, and it is tobe understood that the terminology which has been used is intended to bein the nature of words of description rather than of limitation. Manymodifications and variations of the present invention are possible inlight of the above teachings, and the invention may be practicedotherwise than as specifically described.

1. A photovoltaic cell module comprising: A. a first outermost layerhaving a light transmittance of at least 70 percent as determined byUV/Vis spectrophotometry using ASTM E424-71; B. a photovoltaic celldisposed on said first outermost layer; and C. a second outermost layeropposite said first outermost layer, said second outermost layercomprising a plurality of fibers at least partially coated with asilicone composition and disposed on said photovoltaic cell sandwichingsaid photovoltaic cell between said second outermost layer and saidfirst outermost layer, wherein said silicone composition is furtherdefined as hydrosilylation-curable and comprises: (i) an organosiliconcompound having at least one unsaturated moiety per molecule, (ii) anorganohydrogensilicon compound having at least one silicon-bondedhydrogen atom per molecule, and (iii) a hydrosilylation catalyst used toaccelerate a hydrosilylation reaction between (i) said organosiliconcompound and (ii) said organohydrogensilicon compound, wherein a ratioof silicon-bonded hydrogen atoms per molecule of (ii) saidorganohydrogensilicon compound to unsaturated moieties per molecule of(i) said organosilicon compound is from 0.05 to
 100. 2. A photovoltaiccell module as set forth in claim 1 wherein said plurality of fibers isfurther defined as a non-woven textile.
 3. A photovoltaic cell module asset forth in claim 2 wherein said non-woven textile is selected from thegroup of fiberglass, polyester, polyethylene, polypropylene, nylon, andcombinations thereof.
 4. A photovoltaic cell module as set forth inclaim 1 further comprising a tie layer disposed on said photovoltaiccell and sandwiched between said photovoltaic cell and said firstoutermost layer.
 5. A photovoltaic cell module as set forth in claim 4wherein said tie layer comprises a second silicone composition which isthe same or different as said silicone composition.
 6. A photovoltaiccell as set forth in claim 1 wherein said first outermost layercomprises silicone.
 7. (canceled)
 8. A photovoltaic cell module as setforth in claim 1 wherein said silicone composition is at least partiallycured.
 9. A photovoltaic cell module as set forth in claim 1 whereinsaid silicone composition comprises a filler.
 10. A photovoltaic cellmodule as set forth in claim 1 wherein said second outermost layer has athickness of from 4 to 40 mils.
 11. A photovoltaic cell module as setforth in claim 1 that is free of polyethylene terephthalate,polyethylene naphthalate, polyvinyl fluoride, and ethylene vinylacetate.
 12. A method of forming a photovoltaic cell module comprising afirst outermost layer having a light transmittance of at least 70percent as determined by UV/Vis spectrophotometry using ASTM E424-71, aphotovoltaic cell disposed on the first outermost layer, and a secondlayer disposed on the photovoltaic cell sandwiching the photovoltaiccell between the second layer and the first outermost layer andcomprising a plurality of fibers at least partially coated with a liquidsilicone composition having a viscosity of less than about 100,000 cpsat 25° C., said method comprising the steps of: A. disposing thephotovoltaic cell on the first outermost layer; B. disposing the liquidsilicone composition on the photovoltaic cell; and C. at least partiallycoating the plurality of fibers with the liquid silicone composition toform the second layer; and D. compressing the first outermost layer, thephotovoltaic cell, and the second layer to form the photovoltaic cellmodule, wherein the plurality of fibers extends laterally across thesecond layer to a periphery of the photovoltaic cell module on both endsof the module to resist leakage of the liquid silicone composition fromthe photovoltaic cell module during the step of compressing.
 13. Amethod as set forth in claim 12 wherein the plurality of fibers is atleast partially coated prior to the step of disposing the liquidsilicone composition on the photovoltaic cell.
 14. A method as set forthin claim 12 wherein the plurality of fibers is at least partially coatedafter the step of disposing the liquid silicone composition on thephotovoltaic cell.
 15. A method as set forth in claim 12 wherein theplurality of fibers is at least partially coated simultaneously with thestep of disposing the liquid silicone composition on the photovoltaiccell.
 16. A method as set forth in claim 12 wherein the step ofdisposing the photovoltaic cell on the first outermost layer is furtherdefined as disposing the photovoltaic cell directly on the firstoutermost layer via chemical vapor deposition or physical sputtering.17. A method as set forth in claim 12 wherein the second layer isfurther defined as a controlled bead disposed on the photovoltaic cell.18. A method as set forth in claim 12 wherein the photovoltaic cellmodule further comprises a second outermost layer disposed on the secondlayer opposite the first outermost layer for supporting the photovoltaiccell module.
 19. A method as set forth in claim 12 wherein the liquidsilicone composition is further defined as hydrosilylation-curable andcomprises: (i) an organosilicon compound having at least one unsaturatedmoiety per molecule, (ii) an organohydrogensilicon compound having atleast one silicon-bonded hydrogen atom per molecule, and (iii) ahydrosilylation catalyst used to accelerate a hydrosilylation reactionbetween (i) the organosilicon compound and (ii) theorganohydrogensilicon compound, wherein a ratio of silicon-bondedhydrogen atoms per molecule of (ii) the organohydrogensilicon compoundto unsaturated moieties per molecule of (i) the organosilicon compoundis from 0.05 to
 100. 20. A photovoltaic cell module as set forth inclaim 1: wherein said silicone composition is further defined ascomprising a linear organosilicon compound having two terminalunsaturated moieties per molecule and present in an amount of from 80 to95 parts by weight, a branched organosilicon compound having twoterminal unsaturated moieties per molecule and at least one pendantunsaturated moiety per molecule and present in an amount of from 5 to 20as parts by weight, per 100 parts by weight of a sum of said linearorganosilicon compound and said branched organosilicon compound, and anorganohydrogensilicon compound having at least three silicon-bondedhydrogen atoms per molecule wherein a ratio of silicon-bonded hydrogenatoms per molecule of said organohydrogensilicon compound to a sum ofunsaturated moieties per molecule of said linear organosilicon compoundand branched organosilicon compound is from 1 to 1.7.
 21. (canceled) 22.(canceled)
 23. (canceled)
 24. (canceled)
 25. (canceled)
 26. (canceled)27. (canceled)
 28. A photovoltaic cell module as set forth in claim 20wherein said linear organosilicon compound is further defined as a vinylend-blocked polydialkylsiloxane, said branched organosilicon compound isfurther defined as a vinyl end-blocked polydialkylsiloxane having atleast one vinyl pendant group, and said organohydrogensilicon compoundis further defined as a dimethyl, methylhydrogen siloxane that istrimethylsiloxy terminated.
 29. (canceled)
 30. (canceled)
 31. (canceled)32. (canceled)
 33. (canceled)
 34. (canceled)
 35. (canceled) 36.(canceled)